Reference Type | Journal (article/letter/editorial) |
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Title | Particle size effect on the elevated temperature wear behavior of SiCp/Cu composites |
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Journal | Journal of Materials Science |
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Authors | Zhan, Yongzhong | Author |
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Zhang, Guoding | Author |
Year | 2005 (January) | Volume | 40 |
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Publisher | Springer Science and Business Media LLC |
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DOI | doi:10.1007/s10853-005-5713-2Search in ResearchGate |
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| Generate Citation Formats |
Mindat Ref. ID | 10002810 | Long-form Identifier | mindat:1:5:10002810:6 |
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GUID | 0 |
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Full Reference | Zhan, Yongzhong, Zhang, Guoding (2005) Particle size effect on the elevated temperature wear behavior of SiCp/Cu composites. Journal of Materials Science, 40. 223-225 doi:10.1007/s10853-005-5713-2 |
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Plain Text | Zhan, Yongzhong, Zhang, Guoding (2005) Particle size effect on the elevated temperature wear behavior of SiCp/Cu composites. Journal of Materials Science, 40. 223-225 doi:10.1007/s10853-005-5713-2 |
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In | (n.d.) Journal of Materials Science Vol. 40. Springer Science and Business Media LLC |
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