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Zhang, Yin (2008) Interface layer effect on the stress distribution of a wafer-bonded bilayer structure. Journal of Materials Science, 43. 88-97 doi:10.1007/s10853-007-2136-2

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Reference TypeJournal (article/letter/editorial)
TitleInterface layer effect on the stress distribution of a wafer-bonded bilayer structure
JournalJournal of Materials Science
AuthorsZhang, YinAuthor
Year2008 (January)Volume43
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1007/s10853-007-2136-2Search in ResearchGate
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Mindat Ref. ID10006533Long-form Identifiermindat:1:5:10006533:0
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Full ReferenceZhang, Yin (2008) Interface layer effect on the stress distribution of a wafer-bonded bilayer structure. Journal of Materials Science, 43. 88-97 doi:10.1007/s10853-007-2136-2
Plain TextZhang, Yin (2008) Interface layer effect on the stress distribution of a wafer-bonded bilayer structure. Journal of Materials Science, 43. 88-97 doi:10.1007/s10853-007-2136-2
In(n.d.) Journal of Materials Science Vol. 43. Springer Science and Business Media LLC

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