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Hsu, Chia-ming, Chen, Sinn-wen (2013) Interfacial reactions with and without current stressing at Sn–Co/Ag and Sn–Co/Cu solder joints. Journal of Materials Science, 48. 6640-6646 doi:10.1007/s10853-013-7464-9

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Reference TypeJournal (article/letter/editorial)
TitleInterfacial reactions with and without current stressing at Sn–Co/Ag and Sn–Co/Cu solder joints
JournalJournal of Materials Science
AuthorsHsu, Chia-mingAuthor
Chen, Sinn-wenAuthor
Year2013 (October)Volume48
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1007/s10853-013-7464-9Search in ResearchGate
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Mindat Ref. ID10011595Long-form Identifiermindat:1:5:10011595:0
GUID0
Full ReferenceHsu, Chia-ming, Chen, Sinn-wen (2013) Interfacial reactions with and without current stressing at Sn–Co/Ag and Sn–Co/Cu solder joints. Journal of Materials Science, 48. 6640-6646 doi:10.1007/s10853-013-7464-9
Plain TextHsu, Chia-ming, Chen, Sinn-wen (2013) Interfacial reactions with and without current stressing at Sn–Co/Ag and Sn–Co/Cu solder joints. Journal of Materials Science, 48. 6640-6646 doi:10.1007/s10853-013-7464-9
In(n.d.) Journal of Materials Science Vol. 48. Springer Science and Business Media LLC

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Lin, Shih-kang, Hsu, Che-wei, Chen, Sinn-wen, Hsu, Chia-ming (2013) Interfacial reactions in Sn–20In–2.8Ag/Cu couples. Materials Chemistry and Physics, 142. 268-275 doi:10.1016/j.matchemphys.2013.07.014
Lin, Shih-Kang, Chang, Ru-Bo, Chen, Sinn-Wen, Tsai, Ming-Yueh, Hsu, Chia-Ming (2014) Effects of zinc on the interfacial reactions of tin–indium solder joints with copper. Journal of Materials Science, 49. 3805-3815 doi:10.1007/s10853-014-8092-8
Chen, Sinn-wen, Lee, Wan-yu, Hsu, Chia-ming, Yang, Ching-feng, Hsu, Hsin-yun, Wu, Hsin-jay (2011) Sn–In–Ag phase equilibria and Sn–In–(Ag)/Ag interfacial reactions. Materials Chemistry and Physics, 128. 357-364 doi:10.1016/j.matchemphys.2011.02.078
Chen, Sinn-Wen, Chang, Jui-Shen, Pan, Kevin, Hsu, Chia-Ming, Hsu, Che-Wei (2013) Directional Solidification and Liquidus Projection of the Sn-Co-Cu System. Metallurgical and Materials Transactions A, 44 (4). 1656-1664 doi:10.1007/s11661-012-1545-2
Chen, Sinn-wen, Yang, Ching-feng, Wu, Hsin-jay, Chang, Ru-Bo, Hsu, Chia-ming (2012) Interfacial reactions in the Sn–In–Zn/Ag and Sn–In–Zn/Ni couples. Materials Chemistry and Physics, 132. 481-487 doi:10.1016/j.matchemphys.2011.11.057
Chen, Yu-Kai, Hsu, Chia-Ming, Chen, Sinn-Wen, Chen, Chih-Ming, Huang, Yu-Chih (2012) Phase Equilibria of Sn-Co-Cu Ternary System. Metallurgical and Materials Transactions A, 43 (10). 3586-3595 doi:10.1007/s11661-012-1192-7
Chen, Chih-ming, Chen, Sinn-wen (2001) Electromigration effect upon the Sn–0.7 wt% Cu/Ni and Sn–3.5 wt% Ag/Ni interfacial reactions. Journal of Applied Physics, 90 (3). 1208-1214 doi:10.1063/1.1380219
Chen, Sinn-wen, Hsu, Che-wei, Lin, Shih-kang, Hsu, Chia-ming (2013) Reaction evolution in Sn–20.0 wt% In–2.8 wt% Ag/Ni couples. Journal of Materials Research, 28 (23) 3257-3260 doi:10.1557/jmr.2013.308
Huang, Yu-chih, Chen, Sinn-wen (2010) Co alloying and size effects on solidification and interfacial reactions in the Sn–Zn–(Co)/Cu couples. Journal of Materials Research, 25 (12) 2430-2438 doi:10.1557/jmr.2010.0314
Wang, Chao-Hong, Chen, Sinn-Wen (2003) Isothermal section of the ternary Sn-Cu-Ni system and interfacial reactions in the Sn-Cu/Ni couples at 800 °C. Metallurgical and Materials Transactions A, 34 (10). 2281-2287 doi:10.1007/s11661-003-0292-9
Chao, Yi-Hsiang, Chen, Sinn-Wen, Chang, Chih-Hong, Chen, Chih-Chi (2008) Phase Equilibria of Sn-Co-Ni System and Interfacial Reactions in Sn/(Co, Ni) Couples. Metallurgical and Materials Transactions A, 39 (3). 477-489 doi:10.1007/s11661-007-9429-6
 
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