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Lin, D.C., Liu, S., Guo, T.M., Wang, G.-X., Srivatsan, T.S., Petraroli, M. (2003) An investigation of nanoparticles addition on solidification kinetics and microstructure development of tin–lead solder. Materials Science and Engineering: A, 360. 285-292 doi:10.1016/s0921-5093(03)00466-0

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Reference TypeJournal (article/letter/editorial)
TitleAn investigation of nanoparticles addition on solidification kinetics and microstructure development of tin–lead solder
JournalMaterials Science and Engineering: A
AuthorsLin, D.C.Author
Liu, S.Author
Guo, T.M.Author
Wang, G.-X.Author
Srivatsan, T.S.Author
Petraroli, M.Author
Year2003 (November)Volume360
PublisherElsevier BV
DOIdoi:10.1016/s0921-5093(03)00466-0Search in ResearchGate
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Mindat Ref. ID10030605Long-form Identifiermindat:1:5:10030605:1
GUID0
Full ReferenceLin, D.C., Liu, S., Guo, T.M., Wang, G.-X., Srivatsan, T.S., Petraroli, M. (2003) An investigation of nanoparticles addition on solidification kinetics and microstructure development of tin–lead solder. Materials Science and Engineering: A, 360. 285-292 doi:10.1016/s0921-5093(03)00466-0
Plain TextLin, D.C., Liu, S., Guo, T.M., Wang, G.-X., Srivatsan, T.S., Petraroli, M. (2003) An investigation of nanoparticles addition on solidification kinetics and microstructure development of tin–lead solder. Materials Science and Engineering: A, 360. 285-292 doi:10.1016/s0921-5093(03)00466-0
In(n.d.) Materials Science and Engineering: A Vol. 360. Elsevier BV

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Lin, D.C., Wang, G.X., Srivatsan, T.S., Al-Hajri, Meslet, Petraroli, M. (2003) Influence of titanium dioxide nanopowder addition on microstructural development and hardness of tin–lead solder. Materials Letters, 57. 3193-3198 doi:10.1016/s0167-577x(03)00023-5
Lin, D, Wang, G.X, Srivatsan, T.S, Al-Hajri, Meslet, Petraroli, M (2002) The influence of copper nanopowders on microstructure and hardness of lead–tin solder. Materials Letters, 53. 333-338 doi:10.1016/s0167-577x(01)00503-1
Lin, D.C., Kuo, C.Y., Srivatsan, T.S., Petraroli, M., Wang, G.X. (2005) Synthesis and Characterization of Nano-Composite Lead-Free Solder. Journal of Metastable and Nanocrystalline Materials, 23. 145-150 doi:10.4028/www.scientific.net/jmnm.23.145
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