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Yoon, Jeong-Won, Chun, Hyun-Suk, Jung, Seung-Boo (2008) Reliability evaluation of Au–20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au. Materials Science and Engineering: A, 473. 119-125 doi:10.1016/j.msea.2007.03.050

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Reference TypeJournal (article/letter/editorial)
TitleReliability evaluation of Au–20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au
JournalMaterials Science and Engineering: A
AuthorsYoon, Jeong-WonAuthor
Chun, Hyun-SukAuthor
Jung, Seung-BooAuthor
Year2008 (January)Volume473
PublisherElsevier BV
DOIdoi:10.1016/j.msea.2007.03.050Search in ResearchGate
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Mindat Ref. ID10036735Long-form Identifiermindat:1:5:10036735:9
GUID0
Full ReferenceYoon, Jeong-Won, Chun, Hyun-Suk, Jung, Seung-Boo (2008) Reliability evaluation of Au–20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au. Materials Science and Engineering: A, 473. 119-125 doi:10.1016/j.msea.2007.03.050
Plain TextYoon, Jeong-Won, Chun, Hyun-Suk, Jung, Seung-Boo (2008) Reliability evaluation of Au–20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au. Materials Science and Engineering: A, 473. 119-125 doi:10.1016/j.msea.2007.03.050
In(n.d.) Materials Science and Engineering: A Vol. 473. Elsevier BV

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Yoon, Jeong-Won, Chun, Hyun-Suk, Jung, Seung-Boo (2007) Reliability analysis of Au–Sn flip-chip solder bump fabricated by co-electroplating. Journal of Materials Research, 22 (5) 1219-1229 doi:10.1557/jmr.2007.0145
Yoon, Jeong-Won, Jung, Seung-Boo (2007) Solder joint reliability evaluation of Sn–Zn/Au/Ni/Cu ball-grid-array package during aging. Materials Science and Engineering: A, 452. 46-54 doi:10.1016/j.msea.2006.10.163
Yoon, Jeong-Won, Chun, Hyun-Suk, Jung, Seung-Boo (2009) Liquid-state and solid-state interfacial reactions of fluxless-bonded Au–20Sn/ENIG solder joint. Journal of Alloys and Compounds, 469. 108-115 doi:10.1016/j.jallcom.2008.01.077
Yoon, Jeong-Won, Chun, Hyun-Suk, Jung, Seung-Boo (2008) Correlation between interfacial reactions and shear strengths of Sn-Ag-(Cu and Bi-In)/ENIG plated Cu solder joints. Materials Science and Engineering: A, 483. 731-734 doi:10.1016/j.msea.2006.09.162
Yoon, Jeong-Won, Chun, Hyun-Suk, Lee, Hoo-Jeong, Jung, Seung-Boo (2007) Microstructural evolution and interfacial reactions of fluxless-bonded Au-20Sn/Cu solder joint during reflow and aging. Journal of Materials Research, 22 (10) 2817-2824 doi:10.1557/jmr.2007.0352
Koo, Ja-Myeong, Kim, Yu-Na, Yoon, Jeong-Won, Kim, Dae-Gon, Noh, Bo-In, Kim, Jong-Woong, Moon, Jung-Hoon, Jung, Seung-Boo (2008) Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages. Materials Science and Engineering: A, 483. 620-624 doi:10.1016/j.msea.2006.11.164
Chun, Hyun-Suk, Yoon, Jeong-Won, Jung, Seung-Boo (2007) Solid-state interfacial reactions between Sn–3.5Ag–0.7Cu solder and electroless Ni-immersion Au substrate during high temperature storage test. Journal of Alloys and Compounds, 439. 91-96 doi:10.1016/j.jallcom.2006.08.240
Kim, Jungsoo, Jung, Seung-Boo, Yoon, Jeong-Won (2019) Optimal Ni(P) thickness and reliability evaluation of thin-Au/Pd(P)/Ni(P) surface-finish with Sn-3.0Ag-0.5Cu solder joints. Journal of Alloys and Compounds, 805. 1013-1024 doi:10.1016/j.jallcom.2019.07.184
Yoon, Jeong-Won, Chun, Hyun-Suk, Jung, Seung-Boo (2005) Interfacial Reaction and Mechanical Characterization of Eutectic Sn–Zn/ENIG Solder Joints during Reflow and Aging. MATERIALS TRANSACTIONS, 46 (11). 2386-2393 doi:10.2320/matertrans.46.2386
Yoon, Jeong-Won, Jung, Seung-Boo (2006) Interfacial reactions and shear strength on Cu and electrolytic Au/Ni metallization with Sn-Zn solder. Journal of Materials Research, 21 (6) 1590-1599 doi:10.1557/jmr.2006.0198
Yoon, Jeong-Won, Jung, Seung-Boo (2006) Reliability studies of Sn–9Zn/Cu solder joints with aging treatment. Journal of Alloys and Compounds, 407. 141-149 doi:10.1016/j.jallcom.2005.06.047
 
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