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Yang, Lizhuang, Zhou, Wei, Ma, Yong, Li, Xuezheng, Liang, Yinghua, Cui, Wenquan, Wu, Ping (2016) Effects of Ni addition on mechanical properties of Sn58Bi solder alloy during solid-state aging. Materials Science and Engineering: A, 667. 368-375 doi:10.1016/j.msea.2016.05.015

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Reference TypeJournal (article/letter/editorial)
TitleEffects of Ni addition on mechanical properties of Sn58Bi solder alloy during solid-state aging
JournalMaterials Science and Engineering: A
AuthorsYang, LizhuangAuthor
Zhou, WeiAuthor
Ma, YongAuthor
Li, XuezhengAuthor
Liang, YinghuaAuthor
Cui, WenquanAuthor
Wu, PingAuthor
Year2016 (June)Volume667
PublisherElsevier BV
DOIdoi:10.1016/j.msea.2016.05.015Search in ResearchGate
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Mindat Ref. ID10048652Long-form Identifiermindat:1:5:10048652:4
GUID0
Full ReferenceYang, Lizhuang, Zhou, Wei, Ma, Yong, Li, Xuezheng, Liang, Yinghua, Cui, Wenquan, Wu, Ping (2016) Effects of Ni addition on mechanical properties of Sn58Bi solder alloy during solid-state aging. Materials Science and Engineering: A, 667. 368-375 doi:10.1016/j.msea.2016.05.015
Plain TextYang, Lizhuang, Zhou, Wei, Ma, Yong, Li, Xuezheng, Liang, Yinghua, Cui, Wenquan, Wu, Ping (2016) Effects of Ni addition on mechanical properties of Sn58Bi solder alloy during solid-state aging. Materials Science and Engineering: A, 667. 368-375 doi:10.1016/j.msea.2016.05.015
In(n.d.) Materials Science and Engineering: A Vol. 667. Elsevier BV

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