Sandström, Rolf (2017) Formation of a dislocation back stress during creep of copper at low temperatures. Materials Science and Engineering: A, 700. 622-630 doi:10.1016/j.msea.2017.06.042
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Formation of a dislocation back stress during creep of copper at low temperatures | ||
Journal | Materials Science and Engineering: A | ||
Authors | Sandström, Rolf | Author | |
Year | 2017 (July) | Volume | 700 |
Publisher | Elsevier BV | ||
DOI | doi:10.1016/j.msea.2017.06.042Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 10050312 | Long-form Identifier | mindat:1:5:10050312:2 |
GUID | 0 | ||
Full Reference | Sandström, Rolf (2017) Formation of a dislocation back stress during creep of copper at low temperatures. Materials Science and Engineering: A, 700. 622-630 doi:10.1016/j.msea.2017.06.042 | ||
Plain Text | Sandström, Rolf (2017) Formation of a dislocation back stress during creep of copper at low temperatures. Materials Science and Engineering: A, 700. 622-630 doi:10.1016/j.msea.2017.06.042 | ||
In | (n.d.) Materials Science and Engineering: A Vol. 700. Elsevier BV |
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