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Watanabe, Jun, Hatsuzawa, Kenji, Ogata, Shigeyuki, Yoshida, Shinichi, Shohji, Ikuo (2019) Erosion Resistance Properties of Iron–Carbon Composite Plating to Molten Lead-Free Solder. Applied Sciences, 9. 2724pp. doi:10.3390/app9132724

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Reference TypeJournal (article/letter/editorial)
TitleErosion Resistance Properties of Iron–Carbon Composite Plating to Molten Lead-Free Solder
JournalApplied Sciences
AuthorsWatanabe, JunAuthor
Hatsuzawa, KenjiAuthor
Ogata, ShigeyukiAuthor
Yoshida, ShinichiAuthor
Shohji, IkuoAuthor
Year2019 (July 5)Volume9
PublisherMDPI AG
DOIdoi:10.3390/app9132724Search in ResearchGate
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Mindat Ref. ID10098654Long-form Identifiermindat:1:5:10098654:3
GUID0
Full ReferenceWatanabe, Jun, Hatsuzawa, Kenji, Ogata, Shigeyuki, Yoshida, Shinichi, Shohji, Ikuo (2019) Erosion Resistance Properties of Iron–Carbon Composite Plating to Molten Lead-Free Solder. Applied Sciences, 9. 2724pp. doi:10.3390/app9132724
Plain TextWatanabe, Jun, Hatsuzawa, Kenji, Ogata, Shigeyuki, Yoshida, Shinichi, Shohji, Ikuo (2019) Erosion Resistance Properties of Iron–Carbon Composite Plating to Molten Lead-Free Solder. Applied Sciences, 9. 2724pp. doi:10.3390/app9132724
In(n.d.) Applied Sciences Vol. 9. MDPI AG

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Watanabe, Jun, Hatsuzawa, Kenji, Ogata, Shigeyuki, Yoshida, Shinichi, Golberg, Dmitri, Shohji, Ikuo (2022) Erosion Resistance of Iron-Boron Nitride Composite Plating to Molten Lead-Free Solder. MATERIALS TRANSACTIONS, 63 (8) 1112-1119 doi:10.2320/matertrans.mt-mc2022010
Watanabe, J, Sekimori, N, Hatsuzawa, K, Uetani, T, Shohji, I (2012) Study on erosion resistance characteristics of Fe-MWCNT composite plating with respect to lead-free solder. Journal of Physics: Conference Series, 379. 12025pp. doi:10.1088/1742-6596/379/1/012025
Kobayashi, Tatsuya, Shohji, Ikuo (2019) Evaluation of Microstructures and Mechanical Properties of Sn-10Sb-Ni Lead-Free Solder Alloys with Small Amount of Ni Using Miniature Size Specimens. Metals, 9 (12). 1348pp. doi:10.3390/met9121348
Shohji, Ikuo, Osawa, Tsutomu, Okashita, Takeshi, Watanabe, Hirohiko (2008) Impact Properties of Sn-0.75Cu Lead-Free Solder Ball Joint. Key Engineering Materials, 385. 745-748 doi:10.4028/www.scientific.net/kem.385-387.745
MITSUI, Kohei, SHOHJI, Ikuo, KOBAYASHI, Tatsuya, WATANABE, Hirohiko (2019) Effect of Addition of Trace Ni and Ge into Sn-Sb-Ag High Temperature Lead-free Solder Alloy on its Mechanical Properties. Journal of Smart Processing, 9 (3) 133-139 doi:10.7791/jspmee.9.133
Haidong, Zhang, Shohji, Ikuo, Shimoda, Masayoshi, Watanabe, Hirohiko (2016) Effect of Strain Rate and Temperature on Tensile Properties of Bi-Based Lead-Free Solder. MATERIALS TRANSACTIONS, 57 (6). 873-880 doi:10.2320/matertrans.md201517
Shohji, Ikuo, Watanabe, Hirohiko, Okashita, Takeshi, Osawa, Tsutomu (2008) Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode. MATERIALS TRANSACTIONS, 49 (7). 1513-1517 doi:10.2320/matertrans.mf200808
Nakamura, Kiyotomo, Shohji, Ikuo, Goto, Hiroki, Ookubo, Toshikazu (2005) Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating. MATERIALS TRANSACTIONS, 46 (12). 2730-2736 doi:10.2320/matertrans.46.2730
Kobayashi, Tatsuya, Mitsui, Kohei, Shohji, Ikuo (2019) Effects of Ni Addition to Sn–5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties. MATERIALS TRANSACTIONS, 60 (6). 888-894 doi:10.2320/matertrans.mh201809
Shohji, Ikuo, Goto, Hiroki, Nakamura, Kiyotomo, Ookubo, Toshikazu (2005) Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint. MATERIALS TRANSACTIONS, 46 (12). 2725-2729 doi:10.2320/matertrans.46.2725
Liu, Shubin, Shohji, Ikuo, Iioka, Makoto, Hashimoto, Anna, Hirohashi, Junichiro, Wake, Tsunehito, Arai, Susumu (2019) Micro-Brazing of Stainless Steel Using Ni-P Alloy Plating. Applied Sciences, 9. 1094pp. doi:10.3390/app9061094
 
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