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Chu, K., Jia, C. C., Liang, X. B., Chen, H. (2011) Temperature dependence of thermal conductivity in SiCpbased metal–matrix composites. Materials Science and Technology, 27. 91-94 doi:10.1179/026708309x12547309760768

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Reference TypeJournal (article/letter/editorial)
TitleTemperature dependence of thermal conductivity in SiCpbased metal–matrix composites
JournalMaterials Science and Technology
AuthorsChu, K.Author
Jia, C. C.Author
Liang, X. B.Author
Chen, H.Author
Year2011 (January)Volume27
PublisherInforma UK Limited
DOIdoi:10.1179/026708309x12547309760768Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID10307560Long-form Identifiermindat:1:5:10307560:2
GUID0
Full ReferenceChu, K., Jia, C. C., Liang, X. B., Chen, H. (2011) Temperature dependence of thermal conductivity in SiCpbased metal–matrix composites. Materials Science and Technology, 27. 91-94 doi:10.1179/026708309x12547309760768
Plain TextChu, K., Jia, C. C., Liang, X. B., Chen, H. (2011) Temperature dependence of thermal conductivity in SiCpbased metal–matrix composites. Materials Science and Technology, 27. 91-94 doi:10.1179/026708309x12547309760768
In(n.d.) Materials Science and Technology Vol. 27. Informa UK Limited

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