Tsai, Tsung-Yen, Kuo, Chien Hung, Chen, Wen Chi, Hsu, Chia-Hao, Chung, Cheng-Hsien (2010) Reducing the print-through phenomenon and increasing the curing degree of UP/ST/organo-montmorillonite nanocomposites. Applied Clay Science, 49. 224-228 doi:10.1016/j.clay.2010.05.010
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Reducing the print-through phenomenon and increasing the curing degree of UP/ST/organo-montmorillonite nanocomposites | ||
Journal | Applied Clay Science | ||
Authors | Tsai, Tsung-Yen | Author | |
Kuo, Chien Hung | Author | ||
Chen, Wen Chi | Author | ||
Hsu, Chia-Hao | Author | ||
Chung, Cheng-Hsien | Author | ||
Year | 2010 (July) | Volume | 49 |
Publisher | Elsevier BV | ||
DOI | doi:10.1016/j.clay.2010.05.010Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 10364573 | Long-form Identifier | mindat:1:5:10364573:7 |
GUID | 0 | ||
Full Reference | Tsai, Tsung-Yen, Kuo, Chien Hung, Chen, Wen Chi, Hsu, Chia-Hao, Chung, Cheng-Hsien (2010) Reducing the print-through phenomenon and increasing the curing degree of UP/ST/organo-montmorillonite nanocomposites. Applied Clay Science, 49. 224-228 doi:10.1016/j.clay.2010.05.010 | ||
Plain Text | Tsai, Tsung-Yen, Kuo, Chien Hung, Chen, Wen Chi, Hsu, Chia-Hao, Chung, Cheng-Hsien (2010) Reducing the print-through phenomenon and increasing the curing degree of UP/ST/organo-montmorillonite nanocomposites. Applied Clay Science, 49. 224-228 doi:10.1016/j.clay.2010.05.010 | ||
In | (2010) Applied Clay Science Vol. 49. Elsevier BV |
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