Tang, Chao-Sheng, Wang, De-Yin, Zhu, Cheng, Zhou, Qi-You, Xu, Shi-Kang, Shi, Bin (2018) Characterizing drying-induced clayey soil desiccation cracking process using electrical resistivity method. Applied Clay Science, 152. 101-112 doi:10.1016/j.clay.2017.11.001
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Characterizing drying-induced clayey soil desiccation cracking process using electrical resistivity method | ||
Journal | Applied Clay Science | ||
Authors | Tang, Chao-Sheng | Author | |
Wang, De-Yin | Author | ||
Zhu, Cheng | Author | ||
Zhou, Qi-You | Author | ||
Xu, Shi-Kang | Author | ||
Shi, Bin | Author | ||
Year | 2018 (February) | Volume | 152 |
Publisher | Elsevier BV | ||
DOI | doi:10.1016/j.clay.2017.11.001Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 10367352 | Long-form Identifier | mindat:1:5:10367352:5 |
GUID | 0 | ||
Full Reference | Tang, Chao-Sheng, Wang, De-Yin, Zhu, Cheng, Zhou, Qi-You, Xu, Shi-Kang, Shi, Bin (2018) Characterizing drying-induced clayey soil desiccation cracking process using electrical resistivity method. Applied Clay Science, 152. 101-112 doi:10.1016/j.clay.2017.11.001 | ||
Plain Text | Tang, Chao-Sheng, Wang, De-Yin, Zhu, Cheng, Zhou, Qi-You, Xu, Shi-Kang, Shi, Bin (2018) Characterizing drying-induced clayey soil desiccation cracking process using electrical resistivity method. Applied Clay Science, 152. 101-112 doi:10.1016/j.clay.2017.11.001 | ||
In | (2018) Applied Clay Science Vol. 152. Elsevier BV |
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