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Tang, Xin Liang, Liu, Yu Ling, Zhang, Hong Yuan, Bao, Jie (2013) Effects of Alkaline Nano-SiO2 Abrasive on Planarization of 300mm Copper Patterned Wafer. Advanced Materials Research, 634. 2949-2954 doi:10.4028/www.scientific.net/amr.634-638.2949

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Reference TypeJournal (article/letter/editorial)
TitleEffects of Alkaline Nano-SiO2 Abrasive on Planarization of 300mm Copper Patterned Wafer
JournalAdvanced Materials Research
AuthorsTang, Xin LiangAuthor
Liu, Yu LingAuthor
Zhang, Hong YuanAuthor
Bao, JieAuthor
Year2013 (January)Volume634
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/amr.634-638.2949Search in ResearchGate
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Mindat Ref. ID11700113Long-form Identifiermindat:1:5:11700113:0
GUID0
Full ReferenceTang, Xin Liang, Liu, Yu Ling, Zhang, Hong Yuan, Bao, Jie (2013) Effects of Alkaline Nano-SiO2 Abrasive on Planarization of 300mm Copper Patterned Wafer. Advanced Materials Research, 634. 2949-2954 doi:10.4028/www.scientific.net/amr.634-638.2949
Plain TextTang, Xin Liang, Liu, Yu Ling, Zhang, Hong Yuan, Bao, Jie (2013) Effects of Alkaline Nano-SiO2 Abrasive on Planarization of 300mm Copper Patterned Wafer. Advanced Materials Research, 634. 2949-2954 doi:10.4028/www.scientific.net/amr.634-638.2949
In(n.d.) Advanced Materials Research Vol. 634. Trans Tech Publications, Ltd.

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