Reference Type | Journal (article/letter/editorial) |
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Title | Research on Rheological Properties of Room-Temperature Curing Epoxy Adhesive |
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Journal | Advanced Materials Research |
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Authors | Li, Hui | Author |
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Luo, Ying She | Author |
Xie, Jian Jun | Author |
Chen, Sheng Ming | Author |
Year | 2013 (January) | Volume | 639 |
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Publisher | Trans Tech Publications, Ltd. |
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DOI | doi:10.4028/www.scientific.net/amr.639-640.354Search in ResearchGate |
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| Generate Citation Formats |
Mindat Ref. ID | 11700585 | Long-form Identifier | mindat:1:5:11700585:5 |
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GUID | 0 |
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Full Reference | Li, Hui, Luo, Ying She, Xie, Jian Jun, Chen, Sheng Ming (2013) Research on Rheological Properties of Room-Temperature Curing Epoxy Adhesive. Advanced Materials Research, 639. 354-358 doi:10.4028/www.scientific.net/amr.639-640.354 |
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Plain Text | Li, Hui, Luo, Ying She, Xie, Jian Jun, Chen, Sheng Ming (2013) Research on Rheological Properties of Room-Temperature Curing Epoxy Adhesive. Advanced Materials Research, 639. 354-358 doi:10.4028/www.scientific.net/amr.639-640.354 |
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In | (n.d.) Advanced Materials Research Vol. 639. Trans Tech Publications, Ltd. |
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