Reference Type | Journal (article/letter/editorial) |
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Title | Effect of Interface Bond Condition on Airport Double-Layer Pavement Overlay’s Load Stress and Deflection |
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Journal | Advanced Materials Research |
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Authors | Weng, Xing Zhong | Author |
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Yan, Xiang Cheng | Author |
Liu, Wen Lu | Author |
Liang, Lei | Author |
Li, Xin Qiang | Author |
Year | 2013 (January) | Volume | 639 |
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Publisher | Trans Tech Publications, Ltd. |
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DOI | doi:10.4028/www.scientific.net/amr.639-640.429Search in ResearchGate |
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| Generate Citation Formats |
Mindat Ref. ID | 11700600 | Long-form Identifier | mindat:1:5:11700600:5 |
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GUID | 0 |
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Full Reference | Weng, Xing Zhong, Yan, Xiang Cheng, Liu, Wen Lu, Liang, Lei, Li, Xin Qiang (2013) Effect of Interface Bond Condition on Airport Double-Layer Pavement Overlay’s Load Stress and Deflection. Advanced Materials Research, 639. 429-433 doi:10.4028/www.scientific.net/amr.639-640.429 |
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Plain Text | Weng, Xing Zhong, Yan, Xiang Cheng, Liu, Wen Lu, Liang, Lei, Li, Xin Qiang (2013) Effect of Interface Bond Condition on Airport Double-Layer Pavement Overlay’s Load Stress and Deflection. Advanced Materials Research, 639. 429-433 doi:10.4028/www.scientific.net/amr.639-640.429 |
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In | (n.d.) Advanced Materials Research Vol. 639. Trans Tech Publications, Ltd. |
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