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Tang, Wu, Yang, Ji Jun, Li, Chi Ming (2013) Effect of Film Thickness and Annealing Time on Residual Stress of High-k Al2O3 Film on Si-(100) Substrate. Advanced Materials Research, 644. 161-164 doi:10.4028/www.scientific.net/amr.644.161

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Reference TypeJournal (article/letter/editorial)
TitleEffect of Film Thickness and Annealing Time on Residual Stress of High-k Al2O3 Film on Si-(100) Substrate
JournalAdvanced Materials Research
AuthorsTang, WuAuthor
Yang, Ji JunAuthor
Li, Chi MingAuthor
Year2013 (January)Volume644
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/amr.644.161Search in ResearchGate
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Mindat Ref. ID11700988Long-form Identifiermindat:1:5:11700988:4
GUID0
Full ReferenceTang, Wu, Yang, Ji Jun, Li, Chi Ming (2013) Effect of Film Thickness and Annealing Time on Residual Stress of High-k Al2O3 Film on Si-(100) Substrate. Advanced Materials Research, 644. 161-164 doi:10.4028/www.scientific.net/amr.644.161
Plain TextTang, Wu, Yang, Ji Jun, Li, Chi Ming (2013) Effect of Film Thickness and Annealing Time on Residual Stress of High-k Al2O3 Film on Si-(100) Substrate. Advanced Materials Research, 644. 161-164 doi:10.4028/www.scientific.net/amr.644.161
In(n.d.) Advanced Materials Research Vol. 644. Trans Tech Publications, Ltd.

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Wang, Xue Hui, Tang, Wu, Yang, Ji Jun (2012) The Microstructure and Electrical Property of Porous Cu Film on Soft PVDF Substrate. Advanced Materials Research, 472. 1451-1454 doi:10.4028/www.scientific.net/amr.472-475.1451
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