Reference Type | Journal (article/letter/editorial) |
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Title | High Temperature Behaviour of Materials and Components under Creep Conditions |
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Journal | Applied Mechanics and Materials |
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Authors | Hyde, Thomas H. | Author |
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Sun, W. | Author |
Year | 2004 (September) | Volume | 1 |
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Publisher | Trans Tech Publications, Ltd. |
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DOI | doi:10.4028/www.scientific.net/amm.1-2.25Search in ResearchGate |
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| Generate Citation Formats |
Mindat Ref. ID | 11762279 | Long-form Identifier | mindat:1:5:11762279:3 |
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GUID | 0 |
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Full Reference | Hyde, Thomas H., Sun, W. (2004) High Temperature Behaviour of Materials and Components under Creep Conditions. Applied Mechanics and Materials, 1. 25-36 doi:10.4028/www.scientific.net/amm.1-2.25 |
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Plain Text | Hyde, Thomas H., Sun, W. (2004) High Temperature Behaviour of Materials and Components under Creep Conditions. Applied Mechanics and Materials, 1. 25-36 doi:10.4028/www.scientific.net/amm.1-2.25 |
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In | (n.d.) Applied Mechanics and Materials Vol. 1. Trans Tech Publications, Ltd. |
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