Reference Type | Journal (article/letter/editorial) |
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Title | Research Progress on Rapid Curing of Cement-Bonded Particleboard |
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Journal | Applied Mechanics and Materials |
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Authors | Chen, Wei Min | Author |
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Li, Xin Gong | Author |
Ling, Qi Fei | Author |
Year | 2011 (December) | Volume | 148 |
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Publisher | Trans Tech Publications, Ltd. |
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DOI | doi:10.4028/www.scientific.net/amm.148-149.188Search in ResearchGate |
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| Generate Citation Formats |
Mindat Ref. ID | 11778835 | Long-form Identifier | mindat:1:5:11778835:2 |
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GUID | 0 |
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Full Reference | Chen, Wei Min, Li, Xin Gong, Ling, Qi Fei (2011) Research Progress on Rapid Curing of Cement-Bonded Particleboard. Applied Mechanics and Materials, 148. 188-191 doi:10.4028/www.scientific.net/amm.148-149.188 |
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Plain Text | Chen, Wei Min, Li, Xin Gong, Ling, Qi Fei (2011) Research Progress on Rapid Curing of Cement-Bonded Particleboard. Applied Mechanics and Materials, 148. 188-191 doi:10.4028/www.scientific.net/amm.148-149.188 |
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In | (n.d.) Applied Mechanics and Materials Vol. 148. Trans Tech Publications, Ltd. |
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