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Liu, Ling, Wang, Liang (2011) The Simulation Analysis of Mobile Phone Back Cover Injection Molding Based on Moldflow. Applied Mechanics and Materials, 148. 282-285 doi:10.4028/www.scientific.net/amm.148-149.282

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Reference TypeJournal (article/letter/editorial)
TitleThe Simulation Analysis of Mobile Phone Back Cover Injection Molding Based on Moldflow
JournalApplied Mechanics and Materials
AuthorsLiu, LingAuthor
Wang, LiangAuthor
Year2011 (December)Volume148
PublisherTrans Tech Publications, Ltd.
DOIdoi:10.4028/www.scientific.net/amm.148-149.282Search in ResearchGate
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Mindat Ref. ID11778857Long-form Identifiermindat:1:5:11778857:4
GUID0
Full ReferenceLiu, Ling, Wang, Liang (2011) The Simulation Analysis of Mobile Phone Back Cover Injection Molding Based on Moldflow. Applied Mechanics and Materials, 148. 282-285 doi:10.4028/www.scientific.net/amm.148-149.282
Plain TextLiu, Ling, Wang, Liang (2011) The Simulation Analysis of Mobile Phone Back Cover Injection Molding Based on Moldflow. Applied Mechanics and Materials, 148. 282-285 doi:10.4028/www.scientific.net/amm.148-149.282
In(n.d.) Applied Mechanics and Materials Vol. 148. Trans Tech Publications, Ltd.

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