Gonzaga, J, Ubando, A T, Arriola, E, Moran, R L, Lim, N R E, Mercado, J P, Conversion, A, Belarmino, D (2021) Drop test analysis of ball grid array package using finite element method. IOP Conference Series: Materials Science and Engineering, 1109 (1) 12023pp. doi:10.1088/1757-899x/1109/1/012023
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Drop test analysis of ball grid array package using finite element method | ||
Journal | IOP Conference Series: Materials Science and Engineering | ||
Authors | Gonzaga, J | Author | |
Ubando, A T | Author | ||
Arriola, E | Author | ||
Moran, R L | Author | ||
Lim, N R E | Author | ||
Mercado, J P | Author | ||
Conversion, A | Author | ||
Belarmino, D | Author | ||
Year | 2021 (March 1) | Volume | 1109 |
Issue | 1 | ||
Publisher | IOP Publishing | ||
DOI | doi:10.1088/1757-899x/1109/1/012023Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 13302933 | Long-form Identifier | mindat:1:5:13302933:0 |
GUID | 0 | ||
Full Reference | Gonzaga, J, Ubando, A T, Arriola, E, Moran, R L, Lim, N R E, Mercado, J P, Conversion, A, Belarmino, D (2021) Drop test analysis of ball grid array package using finite element method. IOP Conference Series: Materials Science and Engineering, 1109 (1) 12023pp. doi:10.1088/1757-899x/1109/1/012023 | ||
Plain Text | Gonzaga, J, Ubando, A T, Arriola, E, Moran, R L, Lim, N R E, Mercado, J P, Conversion, A, Belarmino, D (2021) Drop test analysis of ball grid array package using finite element method. IOP Conference Series: Materials Science and Engineering, 1109 (1) 12023pp. doi:10.1088/1757-899x/1109/1/012023 | ||
In | (2021, March) IOP Conference Series: Materials Science and Engineering Vol. 1109 (1) IOP Publishing |
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