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Brunetti, B., Gozzi, D., Iervolino, M., Piacente, V., Zanicchi, G., Parodi, N., Borzone, G. (2006) Bismuth activity in lead-free solder Bi–In–Sn alloys. Calphad, 30 (4) 431-442 doi:10.1016/j.calphad.2006.07.003

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Reference TypeJournal (article/letter/editorial)
TitleBismuth activity in lead-free solder Bi–In–Sn alloys
JournalCalphad
AuthorsBrunetti, B.Author
Gozzi, D.Author
Iervolino, M.Author
Piacente, V.Author
Zanicchi, G.Author
Parodi, N.Author
Borzone, G.Author
Year2006 (December)Volume30
Issue4
PublisherElsevier BV
DOIdoi:10.1016/j.calphad.2006.07.003Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID14973887Long-form Identifiermindat:1:5:14973887:5
GUID0
Full ReferenceBrunetti, B., Gozzi, D., Iervolino, M., Piacente, V., Zanicchi, G., Parodi, N., Borzone, G. (2006) Bismuth activity in lead-free solder Bi–In–Sn alloys. Calphad, 30 (4) 431-442 doi:10.1016/j.calphad.2006.07.003
Plain TextBrunetti, B., Gozzi, D., Iervolino, M., Piacente, V., Zanicchi, G., Parodi, N., Borzone, G. (2006) Bismuth activity in lead-free solder Bi–In–Sn alloys. Calphad, 30 (4) 431-442 doi:10.1016/j.calphad.2006.07.003
In(2006, December) Calphad Vol. 30 (4) Elsevier BV

See Also

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Brunetti, B., Gozzi, D., Iervolino, M., Latini, A., Piacente, V. (2007) Thermodynamics of Bismuth in the Molten Ag−Bi−Sn System. Journal of Chemical & Engineering Data, 52 (4) 1394-1400 doi:10.1021/je7000914
Borzone, G., Parodi, N., Cacciamani, G., Watson, A. (2009) Phase equilibria in the Au–In–Sn ternary system. Calphad, 33 (1) 17-22 doi:10.1016/j.calphad.2008.09.008
Rosalbino, F., Angelini, E., Zanicchi, G., Marazza, R. (2008) Corrosion behaviour assessment of lead-free Sn–Ag–M (M=In, Bi, Cu) solder alloys. Materials Chemistry and Physics, 109. 386-391 doi:10.1016/j.matchemphys.2007.12.006
Amore, S., Delsante, S., Parodi, N., Borzone, G. (2008) Calorimetric investigation of the Cu-Sn-Bi lead-free solder system. Journal of Thermal Analysis and Calorimetry, 92 (1) 227-232 doi:10.1007/s10973-007-8814-0
Yuan, Y., Borzone, G., Zanicchi, G., Delsante, S. (2011) Lead-free soldering: Investigation of the Cu–Sn–Sb system along the Sn:Sb=1:1 isopleth. Journal of Alloys and Compounds, 509. 1595-1600 doi:10.1016/j.jallcom.2010.10.186
Cacciamani, G., Borzone, G., Watson, A. (2009) Thermodynamic modelling and assessment of the Au–In–Sn system. Calphad, 33 (1) 100-108 doi:10.1016/j.calphad.2008.09.018
Delsante, S., Borzone, G. (2014) Thermochemical investigation of Sm–Mg alloys. Calphad, 44. 10-13 doi:10.1016/j.calphad.2013.07.012
Mouas, M., Gasser, J.-G., Hellal, S., Grosdidier, B. (2014) Static structure and dynamic properties in liquid Sn96.2 Ag3.8 lead free solder: Structure factor, diffusion coefficients and viscosity. Calphad, 44. 102-107 doi:10.1016/j.calphad.2013.07.006
Kopyto, M., Garzel, G., Zabdyr, L.A. (2009) Thermodynamic properties of the liquid Bi-Cu-Sn lead-free solder alloys. Journal of Mining and Metallurgy, Section B: Metallurgy, 45 (1). 95-100 doi:10.2298/jmmb0901095k
Tao, Dong Ping (2008) Prediction of activities of all components in the lead-free solder systems Bi–In–Sn and Bi–In–Sn–Zn. Journal of Alloys and Compounds, 457. 124-130 doi:10.1016/j.jallcom.2007.02.123
Garzel, G., Kopyto, M., Zabdyr, L.A. (2014) Thermodynamic properties of the liquid Ag-Bi-Cu-Sn lead-free solder alloys. Journal of Mining and Metallurgy, Section B: Metallurgy, 50 (2). 145-148 doi:10.2298/jmmb130727015g
 
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