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Park, Kimoon, Lee, Jinhyun, Kim, Youjung, Yoon, Sangwha, Yoo, Bongyoung (2021) Study of Cu Electrochemical Polishing Mechanism With Observation of Water Acceptor Diffusion. Frontiers in Chemistry, 9. doi:10.3389/fchem.2021.763508

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Reference TypeJournal (article/letter/editorial)
TitleStudy of Cu Electrochemical Polishing Mechanism With Observation of Water Acceptor Diffusion
JournalFrontiers in Chemistry
AuthorsPark, KimoonAuthor
Lee, JinhyunAuthor
Kim, YoujungAuthor
Yoon, SangwhaAuthor
Yoo, BongyoungAuthor
Year2021 (October 21)Volume9
PublisherFrontiers Media SA
DOIdoi:10.3389/fchem.2021.763508Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID15661015Long-form Identifiermindat:1:5:15661015:7
GUID0
Full ReferencePark, Kimoon, Lee, Jinhyun, Kim, Youjung, Yoon, Sangwha, Yoo, Bongyoung (2021) Study of Cu Electrochemical Polishing Mechanism With Observation of Water Acceptor Diffusion. Frontiers in Chemistry, 9. doi:10.3389/fchem.2021.763508
Plain TextPark, Kimoon, Lee, Jinhyun, Kim, Youjung, Yoon, Sangwha, Yoo, Bongyoung (2021) Study of Cu Electrochemical Polishing Mechanism With Observation of Water Acceptor Diffusion. Frontiers in Chemistry, 9. doi:10.3389/fchem.2021.763508
In(2022) Frontiers in Chemistry Vol. 9. Frontiers Media SA

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Kim, Youjung, Jin, Sanghyun, Park, Kimoon, Lee, Jinhyun, Lim, Jae-Hong, Yoo, Bongyoung (2020) Effect of Pulse Current and Pre-annealing on Thermal Extrusion of Cu in Through-Silicon via (TSV) Frontiers in Chemistry, 8. doi:10.3389/fchem.2020.00771
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