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Chunyi, Ye, Xuexian, Wu, Zhibin, Zhang, Ping, Ding, Jing-Li, Luo, Xian-Zhu, Fu (2022) Research Progress of Electroless Plating Technology in Chip Manufacturing. Acta Chimica Sinica, 80 (12) 1643 doi:10.6023/a22080347

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Reference TypeJournal (article/letter/editorial)
TitleResearch Progress of Electroless Plating Technology in Chip Manufacturing
JournalActa Chimica Sinica
AuthorsChunyi, YeAuthor
Xuexian, WuAuthor
Zhibin, ZhangAuthor
Ping, DingAuthor
Jing-Li, LuoAuthor
Xian-Zhu, FuAuthor
Year2022Volume80
Issue12
PublisherShanghai Institute of Organic Chemistry
DOIdoi:10.6023/a22080347Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID15676070Long-form Identifiermindat:1:5:15676070:8
GUID0
Full ReferenceChunyi, Ye, Xuexian, Wu, Zhibin, Zhang, Ping, Ding, Jing-Li, Luo, Xian-Zhu, Fu (2022) Research Progress of Electroless Plating Technology in Chip Manufacturing. Acta Chimica Sinica, 80 (12) 1643 doi:10.6023/a22080347
Plain TextChunyi, Ye, Xuexian, Wu, Zhibin, Zhang, Ping, Ding, Jing-Li, Luo, Xian-Zhu, Fu (2022) Research Progress of Electroless Plating Technology in Chip Manufacturing. Acta Chimica Sinica, 80 (12) 1643 doi:10.6023/a22080347
In(2022) Acta Chimica Sinica Vol. 80 (12) Shanghai Institute of Organic Chemistry

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