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Jia, S.Q., Bolzoni, L., Li, T., Yang, F. (2023) Interface formation evolution of the hot-forged copper-(Cr)diamond composite and its thermal conductivity. Journal of Alloys and Compounds, 943. 169133 doi:10.1016/j.jallcom.2023.169133

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Reference TypeJournal (article/letter/editorial)
TitleInterface formation evolution of the hot-forged copper-(Cr)diamond composite and its thermal conductivity
JournalJournal of Alloys and Compounds
AuthorsJia, S.Q.Author
Bolzoni, L.Author
Li, T.Author
Yang, F.Author
Year2023 (May)Volume943
PublisherElsevier BV
DOIdoi:10.1016/j.jallcom.2023.169133Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID15690796Long-form Identifiermindat:1:5:15690796:7
GUID0
Full ReferenceJia, S.Q., Bolzoni, L., Li, T., Yang, F. (2023) Interface formation evolution of the hot-forged copper-(Cr)diamond composite and its thermal conductivity. Journal of Alloys and Compounds, 943. 169133 doi:10.1016/j.jallcom.2023.169133
Plain TextJia, S.Q., Bolzoni, L., Li, T., Yang, F. (2023) Interface formation evolution of the hot-forged copper-(Cr)diamond composite and its thermal conductivity. Journal of Alloys and Compounds, 943. 169133 doi:10.1016/j.jallcom.2023.169133
In(2023) Journal of Alloys and Compounds Vol. 943. Elsevier BV

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