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Wu, Ning, Cui, Kaiyu, Xu, Qiancheng, Feng, Xue, Liu, Fang, Zhang, Wei, Huang, Yidong (2023) On-chip mechanical exceptional points based on an optomechanical zipper cavity. Science Advances, 9 (3) doi:10.1126/sciadv.abp8892

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Reference TypeJournal (article/letter/editorial)
TitleOn-chip mechanical exceptional points based on an optomechanical zipper cavity
JournalScience Advances
AuthorsWu, NingAuthor
Cui, KaiyuAuthor
Xu, QianchengAuthor
Feng, XueAuthor
Liu, FangAuthor
Zhang, WeiAuthor
Huang, YidongAuthor
Year2023 (January 18)Volume9
Issue3
PublisherAmerican Association for the Advancement of Science (AAAS)
DOIdoi:10.1126/sciadv.abp8892Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID15694046Long-form Identifiermindat:1:5:15694046:9
GUID0
Full ReferenceWu, Ning, Cui, Kaiyu, Xu, Qiancheng, Feng, Xue, Liu, Fang, Zhang, Wei, Huang, Yidong (2023) On-chip mechanical exceptional points based on an optomechanical zipper cavity. Science Advances, 9 (3) doi:10.1126/sciadv.abp8892
Plain TextWu, Ning, Cui, Kaiyu, Xu, Qiancheng, Feng, Xue, Liu, Fang, Zhang, Wei, Huang, Yidong (2023) On-chip mechanical exceptional points based on an optomechanical zipper cavity. Science Advances, 9 (3) doi:10.1126/sciadv.abp8892
In(2023, January) Science Advances Vol. 9 (3) American Association for the Advancement of Science (AAAS)

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