Reference Type | Journal (article/letter/editorial) |
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Title | Effect of MXene fillers on the electrical conductivity of Ag-coated Cu conductive adhesives |
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Journal | Ceramics International |
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Authors | Lu, WenBin | Author |
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Zhang, Yan | Author |
Zhou, JianPing | Author |
Sun, DaQian | Author |
Li, HongMei | Author |
Year | 2023 (March) | Volume | 49 |
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Issue | 6 |
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Publisher | Elsevier BV |
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DOI | doi:10.1016/j.ceramint.2022.11.175Search in ResearchGate |
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| Generate Citation Formats |
Mindat Ref. ID | 15703099 | Long-form Identifier | mindat:1:5:15703099:2 |
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GUID | 0 |
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Full Reference | Lu, WenBin, Zhang, Yan, Zhou, JianPing, Sun, DaQian, Li, HongMei (2023) Effect of MXene fillers on the electrical conductivity of Ag-coated Cu conductive adhesives. Ceramics International, 49 (6) 9978-9984 doi:10.1016/j.ceramint.2022.11.175 |
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Plain Text | Lu, WenBin, Zhang, Yan, Zhou, JianPing, Sun, DaQian, Li, HongMei (2023) Effect of MXene fillers on the electrical conductivity of Ag-coated Cu conductive adhesives. Ceramics International, 49 (6) 9978-9984 doi:10.1016/j.ceramint.2022.11.175 |
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In | (2023, March) Ceramics International Vol. 49 (6) Elsevier BV |
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