Reference Type | Journal (article/letter/editorial) |
---|
Title | Effect of additional iron and tin on the diffusion reaction at Sn-Cu alloy interface |
---|
Journal | Journal of Materials Science Letters |
---|
Authors | Inaba, Michihiko | Author |
---|
Teshima, Koichi | Author |
Hirao, Osamu | Author |
Sakurai, Toshiharu | Author |
Year | 1984 (May) | Volume | 3 |
---|
Issue | 5 |
---|
Publisher | Springer Science and Business Media LLC |
---|
DOI | doi:10.1007/bf00724377Search in ResearchGate |
---|
| Generate Citation Formats |
Mindat Ref. ID | 16408894 | Long-form Identifier | mindat:1:5:16408894:8 |
---|
|
GUID | 0 |
---|
Full Reference | Inaba, Michihiko, Teshima, Koichi, Hirao, Osamu, Sakurai, Toshiharu (1984) Effect of additional iron and tin on the diffusion reaction at Sn-Cu alloy interface. Journal of Materials Science Letters, 3 (5) 400-402 doi:10.1007/bf00724377 |
---|
Plain Text | Inaba, Michihiko, Teshima, Koichi, Hirao, Osamu, Sakurai, Toshiharu (1984) Effect of additional iron and tin on the diffusion reaction at Sn-Cu alloy interface. Journal of Materials Science Letters, 3 (5) 400-402 doi:10.1007/bf00724377 |
---|
In | (1984, May) Journal of Materials Science Letters Vol. 3 (5) Springer Science and Business Media LLC |
---|
These are possibly similar items as determined by title/reference text matching only.