Reference Type | Journal (article/letter/editorial) |
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Title | Effect of chemical bonding at low temperature on the mechanical properties of an unsintered SiC compact |
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Journal | Journal of Materials Science Letters |
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Authors | Birchall, J. D. | Author |
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Alford, N. McN | Author |
Kendall, K. | Author |
Year | 1987 (December) | Volume | 6 |
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Issue | 12 |
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Publisher | Springer Science and Business Media LLC |
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DOI | doi:10.1007/bf01689321Search in ResearchGate |
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| Generate Citation Formats |
Mindat Ref. ID | 16410131 | Long-form Identifier | mindat:1:5:16410131:9 |
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GUID | 0 |
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Full Reference | Birchall, J. D., Alford, N. McN, Kendall, K. (1987) Effect of chemical bonding at low temperature on the mechanical properties of an unsintered SiC compact. Journal of Materials Science Letters, 6 (12) 1456-1458 doi:10.1007/bf01689321 |
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Plain Text | Birchall, J. D., Alford, N. McN, Kendall, K. (1987) Effect of chemical bonding at low temperature on the mechanical properties of an unsintered SiC compact. Journal of Materials Science Letters, 6 (12) 1456-1458 doi:10.1007/bf01689321 |
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In | (1987, December) Journal of Materials Science Letters Vol. 6 (12) Springer Science and Business Media LLC |
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