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Birchall, J. D., Alford, N. McN, Kendall, K. (1987) Effect of chemical bonding at low temperature on the mechanical properties of an unsintered SiC compact. Journal of Materials Science Letters, 6 (12) 1456-1458 doi:10.1007/bf01689321

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Reference TypeJournal (article/letter/editorial)
TitleEffect of chemical bonding at low temperature on the mechanical properties of an unsintered SiC compact
JournalJournal of Materials Science Letters
AuthorsBirchall, J. D.Author
Alford, N. McNAuthor
Kendall, K.Author
Year1987 (December)Volume6
Issue12
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1007/bf01689321Search in ResearchGate
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Mindat Ref. ID16410131Long-form Identifiermindat:1:5:16410131:9
GUID0
Full ReferenceBirchall, J. D., Alford, N. McN, Kendall, K. (1987) Effect of chemical bonding at low temperature on the mechanical properties of an unsintered SiC compact. Journal of Materials Science Letters, 6 (12) 1456-1458 doi:10.1007/bf01689321
Plain TextBirchall, J. D., Alford, N. McN, Kendall, K. (1987) Effect of chemical bonding at low temperature on the mechanical properties of an unsintered SiC compact. Journal of Materials Science Letters, 6 (12) 1456-1458 doi:10.1007/bf01689321
In(1987, December) Journal of Materials Science Letters Vol. 6 (12) Springer Science and Business Media LLC


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