Hu, L., Yang, M., Wang, C. (1998) Journal of Thermal Analysis and Calorimetry, 53 (3) Springer Science and Business Media LLC. 855-859 doi:10.1023/a:1010138317975
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Journal | Journal of Thermal Analysis and Calorimetry | ||
Authors | Hu, L. | Author | |
Yang, M. | Author | ||
Wang, C. | Author | ||
Year | 1998 | Volume | 53 |
Issue | 3 | ||
Publisher | Springer Science and Business Media LLC | ||
DOI | doi:10.1023/a:1010138317975Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 16441636 | Long-form Identifier | mindat:1:5:16441636:9 |
GUID | 0 | ||
Full Reference | Hu, L., Yang, M., Wang, C. (1998) Journal of Thermal Analysis and Calorimetry, 53 (3) Springer Science and Business Media LLC. 855-859 doi:10.1023/a:1010138317975 | ||
Plain Text | Hu, L., Yang, M., Wang, C. (1998) Journal of Thermal Analysis and Calorimetry, 53 (3) Springer Science and Business Media LLC. 855-859 doi:10.1023/a:1010138317975 | ||
In | (1998) Journal of Thermal Analysis and Calorimetry Vol. 53 (3) Springer Science and Business Media LLC |
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