Dogonchi, A. S., Ismael, Muneer A., Chamkha, Ali J., Ganji, D. D. (2019) Numerical analysis of natural convection of Cu–water nanofluid filling triangular cavity with semicircular bottom wall. Journal of Thermal Analysis and Calorimetry, 135 (6) 3485-3497 doi:10.1007/s10973-018-7520-4
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Numerical analysis of natural convection of Cu–water nanofluid filling triangular cavity with semicircular bottom wall | ||
Journal | Journal of Thermal Analysis and Calorimetry | ||
Authors | Dogonchi, A. S. | Author | |
Ismael, Muneer A. | Author | ||
Chamkha, Ali J. | Author | ||
Ganji, D. D. | Author | ||
Year | 2019 (March) | Volume | 135 |
Issue | 6 | ||
Publisher | Springer Science and Business Media LLC | ||
DOI | doi:10.1007/s10973-018-7520-4Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 16454928 | Long-form Identifier | mindat:1:5:16454928:9 |
GUID | 0 | ||
Full Reference | Dogonchi, A. S., Ismael, Muneer A., Chamkha, Ali J., Ganji, D. D. (2019) Numerical analysis of natural convection of Cu–water nanofluid filling triangular cavity with semicircular bottom wall. Journal of Thermal Analysis and Calorimetry, 135 (6) 3485-3497 doi:10.1007/s10973-018-7520-4 | ||
Plain Text | Dogonchi, A. S., Ismael, Muneer A., Chamkha, Ali J., Ganji, D. D. (2019) Numerical analysis of natural convection of Cu–water nanofluid filling triangular cavity with semicircular bottom wall. Journal of Thermal Analysis and Calorimetry, 135 (6) 3485-3497 doi:10.1007/s10973-018-7520-4 | ||
In | (2019, March) Journal of Thermal Analysis and Calorimetry Vol. 135 (6) Springer Science and Business Media LLC |
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