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KODERA, Masako, UEKUSA, Shin-ichiro, MINAGAWA, Sumito, NISHIOKA, Yukiko, FUKUNAGA, Akira, TSUJIMURA, Manabu (2004) Copper Surface Analyses after Cu CMP Processing. Electrochemistry, 72 (8) 569-576 doi:10.5796/electrochemistry.72.569

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Reference TypeJournal (article/letter/editorial)
TitleCopper Surface Analyses after Cu CMP Processing
JournalElectrochemistry
AuthorsKODERA, MasakoAuthor
UEKUSA, Shin-ichiroAuthor
MINAGAWA, SumitoAuthor
NISHIOKA, YukikoAuthor
FUKUNAGA, AkiraAuthor
TSUJIMURA, ManabuAuthor
Year2004 (August 5)Volume72
Issue8
PublisherThe Electrochemical Society of Japan
DOIdoi:10.5796/electrochemistry.72.569Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID16505005Long-form Identifiermindat:1:5:16505005:0
GUID0
Full ReferenceKODERA, Masako, UEKUSA, Shin-ichiro, MINAGAWA, Sumito, NISHIOKA, Yukiko, FUKUNAGA, Akira, TSUJIMURA, Manabu (2004) Copper Surface Analyses after Cu CMP Processing. Electrochemistry, 72 (8) 569-576 doi:10.5796/electrochemistry.72.569
Plain TextKODERA, Masako, UEKUSA, Shin-ichiro, MINAGAWA, Sumito, NISHIOKA, Yukiko, FUKUNAGA, Akira, TSUJIMURA, Manabu (2004) Copper Surface Analyses after Cu CMP Processing. Electrochemistry, 72 (8) 569-576 doi:10.5796/electrochemistry.72.569
In(2004, August) Electrochemistry Vol. 72 (8) The Electrochemical Society of Japan

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