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LU, Jianhong, WANG, Mingyong, DENG, Xiaomei, YAN, Jianhei, YUN, Jimmy, JIAO, Shuqiang (2019) Evaluation of K<sub>3</sub>Fe(CN)<sub>6</sub> on Deposition Behavior and Structure of Electroless Copper Plating. Electrochemistry, 87 (4) 214-219 doi:10.5796/electrochemistry.19-00010

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Reference TypeJournal (article/letter/editorial)
TitleEvaluation of K<sub>3</sub>Fe(CN)<sub>6</sub> on Deposition Behavior and Structure of Electroless Copper Plating
JournalElectrochemistry
AuthorsLU, JianhongAuthor
WANG, MingyongAuthor
DENG, XiaomeiAuthor
YAN, JianheiAuthor
YUN, JimmyAuthor
JIAO, ShuqiangAuthor
Year2019 (July 5)Volume87
Issue4
PublisherThe Electrochemical Society of Japan
DOIdoi:10.5796/electrochemistry.19-00010Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID16508047Long-form Identifiermindat:1:5:16508047:7
GUID0
Full ReferenceLU, Jianhong, WANG, Mingyong, DENG, Xiaomei, YAN, Jianhei, YUN, Jimmy, JIAO, Shuqiang (2019) Evaluation of K<sub>3</sub>Fe(CN)<sub>6</sub> on Deposition Behavior and Structure of Electroless Copper Plating. Electrochemistry, 87 (4) 214-219 doi:10.5796/electrochemistry.19-00010
Plain TextLU, Jianhong, WANG, Mingyong, DENG, Xiaomei, YAN, Jianhei, YUN, Jimmy, JIAO, Shuqiang (2019) Evaluation of K<sub>3</sub>Fe(CN)<sub>6</sub> on Deposition Behavior and Structure of Electroless Copper Plating. Electrochemistry, 87 (4) 214-219 doi:10.5796/electrochemistry.19-00010
In(2019, July) Electrochemistry Vol. 87 (4) The Electrochemical Society of Japan

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