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Huang, J.R., Tsai, C.M., Lin, Y.W., Kao, C.R. (2008) Pronounced electromigration of Cu in molten Sn-based solders. Journal of Materials Research, 23 (1) 250-257 doi:10.1557/jmr.2008.0024

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Reference TypeJournal (article/letter/editorial)
TitlePronounced electromigration of Cu in molten Sn-based solders
JournalJournal of Materials Research
AuthorsHuang, J.R.Author
Tsai, C.M.Author
Lin, Y.W.Author
Kao, C.R.Author
Year2008 (January)Volume23
Issue1
PublisherSpringer Science and Business Media LLC
DOIdoi:10.1557/jmr.2008.0024Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID17104078Long-form Identifiermindat:1:5:17104078:6
GUID0
Full ReferenceHuang, J.R., Tsai, C.M., Lin, Y.W., Kao, C.R. (2008) Pronounced electromigration of Cu in molten Sn-based solders. Journal of Materials Research, 23 (1) 250-257 doi:10.1557/jmr.2008.0024
Plain TextHuang, J.R., Tsai, C.M., Lin, Y.W., Kao, C.R. (2008) Pronounced electromigration of Cu in molten Sn-based solders. Journal of Materials Research, 23 (1) 250-257 doi:10.1557/jmr.2008.0024
In(2008, January) Journal of Materials Research Vol. 23 (1) Springer Science and Business Media LLC

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Tsai, M.H., Lin, Y.W., Chuang, H.Y., Kao, C.R. (2009) Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate. Journal of Materials Research, 24 (11) 3407-3411 doi:10.1557/jmr.2009.0398
Yang, S.C., Ho, C.E., Chang, C.W., Kao, C.R. (2006) Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu. Journal of Materials Research, 21 (10) 2436-2439 doi:10.1557/jmr.2006.0320
Kuo, Shih-Ming, Lin, Kwang-Lung (2008) Polarity effect of electromigration on intermetallic compound formation in a Cu/Sn–9Zn/Cu sandwich. Journal of Materials Research, 23 (4) 1087-1094 doi:10.1557/jmr.2008.0142
Chiu, Tsung-Chieh, Lin, Kwang-Lung (2008) Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination. Journal of Materials Research, 23 (1) 264-273 doi:10.1557/jmr.2008.0036
Huang, Yu-chih, Chen, Sinn-wen, Gierlotka, Wojcieh, Chang, Chia-hua, Wu, Jen-chin (2007) Dissolution and interfacial reactions of Fe in molten Sn-Cu and Sn-Pb solders. Journal of Materials Research, 22 (10) 2924-2929 doi:10.1557/jmr.2007.0361
Wang, Y.W., Lin, Y.W., Kao, C.R. (2010) Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to solders. Journal of Alloys and Compounds, 493. 233-239 doi:10.1016/j.jallcom.2009.12.062
Huang, Chia-Wei, Lin, Kwang-Lung (2004) Interfacial reactions of lead-free Sn–Zn based solders on Cu and Cu plated electroless Ni–P/Au layer under aging at 150 °C. Journal of Materials Research, 19 (12) 3560-3568 doi:10.1557/jmr.2004.0458
Chen, W. T., Ho, C. E., Kao, C. R. (2002) Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders. Journal of Materials Research, 17 (2) 263-266 doi:10.1557/jmr.2002.0036
Hu, Y.C., Lin, Y.H., Kao, C.R., Tu, K.N. (2003) Electromigration failure in flip chip solder joints due to rapid dissolution of copper. Journal of Materials Research, 18 (11) 2544-2548 doi:10.1557/jmr.2003.0355
Lin, Y.H., Tsai, C.M., Hu, Y.C., Lin, Y.L., Tsai, J.Y., Kao, C.R. (2005) Electromigration Induced Metal Dissolution in Flip-Chip Solder Joints. Materials Science Forum, 475. 2655-2658 doi:10.4028/www.scientific.net/msf.475-479.2655
Luo, W.C., Ho, C.E., Tsai, J.Y., Lin, Y.L., Kao, C.R. (2005) Solid-state reactions between Ni and Sn–Ag–Cu solders with different Cu concentrations. Materials Science and Engineering: A, 396. 385-391 doi:10.1016/j.msea.2005.02.008
 
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