Li, Ruiyang, Hussain, Kamal, Liao, Michael E., Huynh, Kenny, Hoque, Md Shafkat Bin, Wyant, Spencer, Koh, Yee Rui, Xu, Zhihao, Wang, Yekan, Luccioni, Dorian P., Cheng, Zhe, Shi, Jingjing, Lee, Eungkyu, Graham, Samuel, Henry, Asegun, Hopkins, Patrick E., Goorsky, Mark S., Khan, M.Asif, Luo, Tengfei (2024) Enhanced Thermal Boundary Conductance across GaN/SiC Interfaces with AlN Transition Layers. ACS Applied Materials & Interfaces, 16 (6) 8109-8118 doi:10.1021/acsami.3c16905
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Enhanced Thermal Boundary Conductance across GaN/SiC Interfaces with AlN Transition Layers | ||
Journal | ACS Applied Materials & Interfaces | ||
Authors | Li, Ruiyang | Author | |
Hussain, Kamal | Author | ||
Liao, Michael E. | Author | ||
Huynh, Kenny | Author | ||
Hoque, Md Shafkat Bin | Author | ||
Wyant, Spencer | Author | ||
Koh, Yee Rui | Author | ||
Xu, Zhihao | Author | ||
Wang, Yekan | Author | ||
Luccioni, Dorian P. | Author | ||
Cheng, Zhe | Author | ||
Shi, Jingjing | Author | ||
Lee, Eungkyu | Author | ||
Graham, Samuel | Author | ||
Henry, Asegun | Author | ||
Hopkins, Patrick E. | Author | ||
Goorsky, Mark S. | Author | ||
Khan, M.Asif | Author | ||
Luo, Tengfei | Author | ||
Year | 2024 (February 14) | Volume | 16 |
Issue | 6 | ||
Publisher | American Chemical Society (ACS) | ||
DOI | doi:10.1021/acsami.3c16905Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 17163977 | Long-form Identifier | mindat:1:5:17163977:5 |
GUID | 0 | ||
Full Reference | Li, Ruiyang, Hussain, Kamal, Liao, Michael E., Huynh, Kenny, Hoque, Md Shafkat Bin, Wyant, Spencer, Koh, Yee Rui, Xu, Zhihao, Wang, Yekan, Luccioni, Dorian P., Cheng, Zhe, Shi, Jingjing, Lee, Eungkyu, Graham, Samuel, Henry, Asegun, Hopkins, Patrick E., Goorsky, Mark S., Khan, M.Asif, Luo, Tengfei (2024) Enhanced Thermal Boundary Conductance across GaN/SiC Interfaces with AlN Transition Layers. ACS Applied Materials & Interfaces, 16 (6) 8109-8118 doi:10.1021/acsami.3c16905 | ||
Plain Text | Li, Ruiyang, Hussain, Kamal, Liao, Michael E., Huynh, Kenny, Hoque, Md Shafkat Bin, Wyant, Spencer, Koh, Yee Rui, Xu, Zhihao, Wang, Yekan, Luccioni, Dorian P., Cheng, Zhe, Shi, Jingjing, Lee, Eungkyu, Graham, Samuel, Henry, Asegun, Hopkins, Patrick E., Goorsky, Mark S., Khan, M.Asif, Luo, Tengfei (2024) Enhanced Thermal Boundary Conductance across GaN/SiC Interfaces with AlN Transition Layers. ACS Applied Materials & Interfaces, 16 (6) 8109-8118 doi:10.1021/acsami.3c16905 | ||
In | (2024, February) ACS Applied Materials & Interfaces Vol. 16 (6) American Chemical Society (ACS) |
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