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Panisara Sukhontapatipak, , Phairote Sungkhaphaitoon, (2023) The Influence of Nickel Addition on Properties of Sn–4.0Zn–0.7Cu Lead-Free Solder. Physics of Metals and Metallography, 124 (13) 1597-1605 doi:10.1134/s0031918x23600082

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Reference TypeJournal (article/letter/editorial)
TitleThe Influence of Nickel Addition on Properties of Sn–4.0Zn–0.7Cu Lead-Free Solder
JournalPhysics of Metals and Metallography
AuthorsPanisara Sukhontapatipak, Author
Phairote Sungkhaphaitoon, Author
Year2023 (December)Volume124
Issue13
PublisherPleiades Publishing Ltd
DOIdoi:10.1134/s0031918x23600082Search in ResearchGate
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Mindat Ref. ID17211036Long-form Identifiermindat:1:5:17211036:5
GUID0
Full ReferencePanisara Sukhontapatipak, , Phairote Sungkhaphaitoon, (2023) The Influence of Nickel Addition on Properties of Sn–4.0Zn–0.7Cu Lead-Free Solder. Physics of Metals and Metallography, 124 (13) 1597-1605 doi:10.1134/s0031918x23600082
Plain TextPanisara Sukhontapatipak, , Phairote Sungkhaphaitoon, (2023) The Influence of Nickel Addition on Properties of Sn–4.0Zn–0.7Cu Lead-Free Solder. Physics of Metals and Metallography, 124 (13) 1597-1605 doi:10.1134/s0031918x23600082
In(2023, December) The Physics of Metals and Metallography Vol. 124 (13) Pleiades Publishing Ltd

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Inkong, Kogaew, Sungkhaphaitoon, Phairote (2017) Effect of Cooling Rate on the Microstructural and Mechanical Properties of Sn-0.3Ag-0.7Cu-0.05Ni Solder Alloy. Key Engineering Materials, 751. 9-13 doi:10.4028/www.scientific.net/kem.751.9
Sungkhaphaitoon, Phairote (2018) Effect of Cooling Speed on the Microstructure and Mechanical Properties of Sn-0.7Cu-0.05Ni Solder Alloy. Materials Science Forum, 934. 73-78 doi:10.4028/www.scientific.net/msf.934.73
Sungkhaphaitoon, Phairote, Suwansukho, Tanyaporn (2020) Effects of Bismuth Content on the Microstructure, Shear Strength and Thermal Properties of Sn-0.7Cu-0.05Ni Solder Joints. Materials Science Forum, 982. 115-120 doi:10.4028/www.scientific.net/msf.982.115
Chantaramanee, Suchart, Sriwittayakul, Worawit, Sungkhaphaitoon, Phairote (2018) Effects of Antimony and Indium Addition on Wettability and Interfacial Reaction of Sn-3.0Ag-0.5Cu Lead Free Solder on Copper Substrate. Materials Science Forum, 928. 188-193 doi:10.4028/www.scientific.net/msf.928.188
Sungkhaphaitoon, Phairote, Plookphol, Thawatchai (2018) The Effects of Antimony Addition on the Microstructural, Mechanical, and Thermal Properties of Sn-3.0Ag-0.5Cu Solder Alloy. Metallurgical and Materials Transactions A, 49 (2). 652-660 doi:10.1007/s11661-017-4439-5
Jayesh, S., Jacob, E. (2019) An Experimental Investigation on the Properties of Two Novel Ternary Solder Alloys Sn–0.5Cu–3Bi and Sn–1Cu–1Ni Replacing Lead. Physics of Metals and Metallography, 120 (13) 1398-1403 doi:10.1134/s0031918x1913009x
Sungkhaphaitoon, Phairote, Plookphol, Thawatchai (2016) Effect of Cooling Rate on the Microstructure and Mechanical Properties of Sn-0.7wt.%Cu Solder Alloy. Key Engineering Materials, 675. 513-516 doi:10.4028/www.scientific.net/kem.675-676.513
Nazri, Sufian Firdaus, Salleh, Mohd Arif Anuar Mohd (2019) Effect of rare-element (Ga) addition on the microstructure and mechanical properties of Sn-0.7Cu and Sn-0.7Cu-0.05Ni lead-free solder alloys. IOP Conference Series: Materials Science and Engineering, 701. 12031pp. doi:10.1088/1757-899x/701/1/012031
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CHANTARAMANEE, Suchart, SUNGKHAPHAITOON, Phairote (2022) Combined effects of Bi and Sb elements on microstructure, thermal and mechanical properties of Sn-0.7Ag-0.5Cu solder alloys. Transactions of Nonferrous Metals Society of China, 32 (10) 3301-3311 doi:10.1016/s1003-6326(22)66021-7
Sungkhaphaitoon, Phairote, Chantaramanee, Suchart (2018) Effects of Indium Content on Microstructural, Mechanical Properties and Melting Temperature of SAC305 Solder Alloys. Russian Journal of Non-Ferrous Metals, 59. 385-392 doi:10.3103/s1067821218040120
 
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