PENG, Chen, WANG, Shan-lin, WU, Ming, YIN, Li-meng, CHEN, Yu-hua, YE, Ke-jiang, CHEN, Wei-zheng, ZHANG, Ti-ming, XIE, Ji-lin (2024) Effect of Ag content on microstructure and mechanical properties of Sn−xAg−0.5Cu solder joints under rapid thermal shock. Transactions of Nonferrous Metals Society of China, 34 (6) 1922-1935 doi:10.1016/s1003-6326(24)66516-7
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | Effect of Ag content on microstructure and mechanical properties of Sn−xAg−0.5Cu solder joints under rapid thermal shock | ||
| Journal | Transactions of Nonferrous Metals Society of China | ||
| Authors | PENG, Chen | Author | |
| WANG, Shan-lin | Author | ||
| WU, Ming | Author | ||
| YIN, Li-meng | Author | ||
| CHEN, Yu-hua | Author | ||
| YE, Ke-jiang | Author | ||
| CHEN, Wei-zheng | Author | ||
| ZHANG, Ti-ming | Author | ||
| XIE, Ji-lin | Author | ||
| Year | 2024 (June) | Volume | 34 |
| Page(s) | 1922-1935 | Issue | 6 |
| Publisher | Elsevier BV | ||
| DOI | doi:10.1016/s1003-6326(24)66516-7Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 17506056 | Long-form Identifier | mindat:1:5:17506056:8 |
| GUID | 0 | ||
| Full Reference | PENG, Chen, WANG, Shan-lin, WU, Ming, YIN, Li-meng, CHEN, Yu-hua, YE, Ke-jiang, CHEN, Wei-zheng, ZHANG, Ti-ming, XIE, Ji-lin (2024) Effect of Ag content on microstructure and mechanical properties of Sn−xAg−0.5Cu solder joints under rapid thermal shock. Transactions of Nonferrous Metals Society of China, 34 (6) 1922-1935 doi:10.1016/s1003-6326(24)66516-7 | ||
| Plain Text | PENG, Chen, WANG, Shan-lin, WU, Ming, YIN, Li-meng, CHEN, Yu-hua, YE, Ke-jiang, CHEN, Wei-zheng, ZHANG, Ti-ming, XIE, Ji-lin (2024) Effect of Ag content on microstructure and mechanical properties of Sn−xAg−0.5Cu solder joints under rapid thermal shock. Transactions of Nonferrous Metals Society of China, 34 (6) 1922-1935 doi:10.1016/s1003-6326(24)66516-7 | ||
| In | (2024, June) Transactions of Nonferrous Metals Society of China Vol. 34 (6) Elsevier BV | ||
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