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Hsu, Hsuan-Ling, Lee, Hsuan, Wang, Chi-Wei, Liang, Chenju, Chen, Chih-Ming (2019) Impurity evaporation and void formation in Sn/Cu solder joints. Materials Chemistry and Physics, 225. 153-158 doi:10.1016/j.matchemphys.2018.12.036

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Reference TypeJournal (article/letter/editorial)
TitleImpurity evaporation and void formation in Sn/Cu solder joints
JournalMaterials Chemistry and Physics
AuthorsHsu, Hsuan-LingAuthor
Lee, HsuanAuthor
Wang, Chi-WeiAuthor
Liang, ChenjuAuthor
Chen, Chih-MingAuthor
Year2019 (March)Volume225
PublisherElsevier BV
DOIdoi:10.1016/j.matchemphys.2018.12.036Search in ResearchGate
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Mindat Ref. ID3065188Long-form Identifiermindat:1:5:3065188:7
GUID0
Full ReferenceHsu, Hsuan-Ling, Lee, Hsuan, Wang, Chi-Wei, Liang, Chenju, Chen, Chih-Ming (2019) Impurity evaporation and void formation in Sn/Cu solder joints. Materials Chemistry and Physics, 225. 153-158 doi:10.1016/j.matchemphys.2018.12.036
Plain TextHsu, Hsuan-Ling, Lee, Hsuan, Wang, Chi-Wei, Liang, Chenju, Chen, Chih-Ming (2019) Impurity evaporation and void formation in Sn/Cu solder joints. Materials Chemistry and Physics, 225. 153-158 doi:10.1016/j.matchemphys.2018.12.036
In(2019) Materials Chemistry and Physics Vol. 225. Elsevier BV

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Lee, Hsuan, Chen, Chih-Ming (2018) Impurity Effects in Electroplated-Copper Solder Joints. Metals, 8 (6). 388pp. doi:10.3390/met8060388
Yu, Tai-Yi, Lee, Hsuan, Hsu, Hsuan-Ling, Dow, Wei-Ping, Cheng, Hsi-Kuei, Liu, Kuo-Chio, Chen, Chih-Ming (2016) Effects of Cu Electroplating Formulas on the Interfacial Microstructures of Sn/Cu Joints. Journal of the Electrochemical Society, 163. doi:10.1149/2.0091614jes
Lee, Hsuan, Yu, Tai-Yi, Cheng, Hsi-Kuei, Liu, Kuo-Chio, Chan, Po-Fan, Dow, Wei-Ping, Chen, Chih-Ming (2017) Impurity Incorporation in the Cu Electrodeposit and Its Effects on the Microstructural Evolution of the Sn/Cu Solder Joints. Journal of the Electrochemical Society, 164. doi:10.1149/2.1171707jes
Hsu, Shao-Yu, Chen, Chih-Ming, Song, Jenn-Ming, Nishikawa, Hiroshi (2022) Surface modification of Cu electroplated layers for Cu–Sn transient liquid phase bonding. Materials Chemistry and Physics, 277. 125621pp. doi:10.1016/j.matchemphys.2021.125621
Mu, Wenkai, Zhou, Wei, Li, Baoling, Wu, Ping (2012) Abnormal accumulation and rotation of Sn in Cu-cored Sn solder joints under current stressing. Materials Chemistry and Physics, 136. 985-989 doi:10.1016/j.matchemphys.2012.08.037
Lin, Shih-kang, Hsu, Che-wei, Chen, Sinn-wen, Hsu, Chia-ming (2013) Interfacial reactions in Sn–20In–2.8Ag/Cu couples. Materials Chemistry and Physics, 142. 268-275 doi:10.1016/j.matchemphys.2013.07.014
Cheng, Hsi-Kuei, Huang, Chin-Wen, Lee, Hsuan, Wang, Ying-Lang, Liu, Tzeng-Feng, Chen, Chih-Ming (2015) Interfacial reactions between Cu and SnAgCu solder doped with minor Ni. Journal of Alloys and Compounds, 622. 529-534 doi:10.1016/j.jallcom.2014.10.121
Wu, Je-Yi, Lee, Hsuan, Wu, Chien-Heng, Lin, Chih-Fan, Dow, Wei-Ping, Chen, Chih-Ming (2014) Effects of Electroplating Additives on the Interfacial Reactions between Sn and Cu Electroplated Layers. Journal of the Electrochemical Society, 161. doi:10.1149/2.0821410jes
Lin, Chi-Pu, Chen, Chih-Ming, Lin, Ching-Hsuan, Su, Wen-Chiung (2010) Interfacial reactions of Sn/Ag/Cu tri-layer on a deformed polyimide substrate. Journal of Alloys and Compounds, 502. doi:10.1016/j.jallcom.2010.04.197
Lee, Chih-Chen, Tasi, I-Hsuan, Chen, Shih-Hsun (2025) Impact of phase separation on corrosion resistance of AlCrFeNi thermal spraying HEA coatings. Materials Chemistry and Physics, 339. doi:10.1016/j.matchemphys.2025.130757
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