Lan, Qing, Cheng, Chunlong, Zhang, Jianfeng, Guo, Ruizhen, Le, Qichi (2019) The relationship between the thermoelectric power and resultant solidification microstructures of Al-Si melt under electromagnetic field. Materials Chemistry and Physics, 231. 203-215 doi:10.1016/j.matchemphys.2019.04.021
| Reference Type | Journal (article/letter/editorial) | ||
|---|---|---|---|
| Title | The relationship between the thermoelectric power and resultant solidification microstructures of Al-Si melt under electromagnetic field | ||
| Journal | Materials Chemistry and Physics | ||
| Authors | Lan, Qing | Author | |
| Cheng, Chunlong | Author | ||
| Zhang, Jianfeng | Author | ||
| Guo, Ruizhen | Author | ||
| Le, Qichi | Author | ||
| Year | 2019 (June) | Volume | 231 |
| Publisher | Elsevier BV | ||
| DOI | doi:10.1016/j.matchemphys.2019.04.021Search in ResearchGate | ||
| Generate Citation Formats | |||
| Mindat Ref. ID | 3065536 | Long-form Identifier | mindat:1:5:3065536:0 |
| GUID | 0 | ||
| Full Reference | Lan, Qing, Cheng, Chunlong, Zhang, Jianfeng, Guo, Ruizhen, Le, Qichi (2019) The relationship between the thermoelectric power and resultant solidification microstructures of Al-Si melt under electromagnetic field. Materials Chemistry and Physics, 231. 203-215 doi:10.1016/j.matchemphys.2019.04.021 | ||
| Plain Text | Lan, Qing, Cheng, Chunlong, Zhang, Jianfeng, Guo, Ruizhen, Le, Qichi (2019) The relationship between the thermoelectric power and resultant solidification microstructures of Al-Si melt under electromagnetic field. Materials Chemistry and Physics, 231. 203-215 doi:10.1016/j.matchemphys.2019.04.021 | ||
| In | (2019) Materials Chemistry and Physics Vol. 231. Elsevier BV | ||
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