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Tripathi, Tripurari S., Karppinen, Maarit (2017) Efficient Process for Direct Atomic Layer Deposition of Metallic Cu Thin Films Based on an Organic Reductant. Chemistry of Materials, 29. 1230-1235 doi:10.1021/acs.chemmater.6b04597

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Reference TypeJournal (article/letter/editorial)
TitleEfficient Process for Direct Atomic Layer Deposition of Metallic Cu Thin Films Based on an Organic Reductant
JournalChemistry of Materials
AuthorsTripathi, Tripurari S.Author
Karppinen, MaaritAuthor
Year2017 (February 14)Volume29
PublisherAmerican Chemical Society (ACS)
DOIdoi:10.1021/acs.chemmater.6b04597Search in ResearchGate
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Mindat Ref. ID4311118Long-form Identifiermindat:1:5:4311118:5
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Full ReferenceTripathi, Tripurari S., Karppinen, Maarit (2017) Efficient Process for Direct Atomic Layer Deposition of Metallic Cu Thin Films Based on an Organic Reductant. Chemistry of Materials, 29. 1230-1235 doi:10.1021/acs.chemmater.6b04597
Plain TextTripathi, Tripurari S., Karppinen, Maarit (2017) Efficient Process for Direct Atomic Layer Deposition of Metallic Cu Thin Films Based on an Organic Reductant. Chemistry of Materials, 29. 1230-1235 doi:10.1021/acs.chemmater.6b04597
In(2017) Chemistry of Materials Vol. 29. American Chemical Society (ACS)

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