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Hau-Riege, C. S., Thompson, C. V. (2000) The effects of microstructural transitions at width transitions on interconnect reliability. Journal of Applied Physics, 87 (12). 8467-8472 doi:10.1063/1.373565

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Reference TypeJournal (article/letter/editorial)
TitleThe effects of microstructural transitions at width transitions on interconnect reliability
JournalJournal of Applied Physics
AuthorsHau-Riege, C. S.Author
Thompson, C. V.Author
Year2000 (June 15)Volume87
Issue12
PublisherAIP Publishing
DOIdoi:10.1063/1.373565Search in ResearchGate
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Mindat Ref. ID5100329Long-form Identifiermindat:1:5:5100329:8
GUID0
Full ReferenceHau-Riege, C. S., Thompson, C. V. (2000) The effects of microstructural transitions at width transitions on interconnect reliability. Journal of Applied Physics, 87 (12). 8467-8472 doi:10.1063/1.373565
Plain TextHau-Riege, C. S., Thompson, C. V. (2000) The effects of microstructural transitions at width transitions on interconnect reliability. Journal of Applied Physics, 87 (12). 8467-8472 doi:10.1063/1.373565
In(2000, June) Journal of Applied Physics Vol. 87 (12) AIP Publishing

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Hau-Riege, Stefan P., Thompson, Carl V. (2001) Experimental characterization and modeling of the reliability of interconnect trees. Journal of Applied Physics, 89 (1). 601-609 doi:10.1063/1.1330547
Hau-Riege, Stefan P., Thompson, Carl V. (2000) Electromigration saturation in a simple interconnect tree. Journal of Applied Physics, 88 (5). 2382-2385 doi:10.1063/1.1288019
Hau-Riege, C. S., Thompson, C. V. (1999) Microstructural evolution induced by scanned laser annealing in Al interconnects. Applied Physics Letters, 75 (10). 1464-1466 doi:10.1063/1.124726
Hau-Riege, C. S., Thompson, C. V. (2000) Use of scanned laser annealing to control the bamboo grain length of Cu interconnects. Applied Physics Letters, 77 (3). 352-354 doi:10.1063/1.126973
Wei, Frank L., Hau-Riege, Christine S., Marathe, Amit P., Thompson, Carl V. (2008) Effects of active atomic sinks and reservoirs on the reliability of Cu∕low-k interconnects. Journal of Applied Physics, 103 (8). 84513pp. doi:10.1063/1.2907962
Hau-Riege, C. S., Thompson, C. V. (2001) Electromigration in Cu interconnects with very different grain structures. Applied Physics Letters, 78 (22). 3451-3453 doi:10.1063/1.1355304
Hau-Riege, Christine S., Hau-Riege, Stefan P., Marathe, Amit P. (2004) The effect of interlevel dielectric on the critical tensile stress to void nucleation for the reliability of Cu interconnects. Journal of Applied Physics, 96 (10). 5792-5796 doi:10.1063/1.1787139
Hau-Riege, Stefan P., Thompson, Carl V. (2000) In situ transmission electron microscope studies of the kinetics of abnormal grain growth in electroplated copper films. Applied Physics Letters, 76 (3). 309-311 doi:10.1063/1.125729
Gan, C. L., Thompson, C. V., Pey, K. L., Choi, W. K. (2003) Experimental characterization and modeling of the reliability of three-terminal dual-damascene Cu interconnect trees. Journal of Applied Physics, 94 (2). 1222-1228 doi:10.1063/1.1585119
Reynolds, D. C., Look, D. C., Jogai, B. (2000) Combined effects of screening and band gap renormalization on the energy of optical transitions in ZnO and GaN. Journal of Applied Physics, 88 (10). 5760-5763 doi:10.1063/1.1320026
Wei, Frank L., Gan, Chee Lip, Tan, Tam Lyn, Hau-Riege, Christine S., Marathe, Amit P., Vlassak, Joost J., Thompson, Carl V. (2008) Electromigration-induced extrusion failures in Cu/low-k interconnects. Journal of Applied Physics, 104 (2). 23529pp. doi:10.1063/1.2957057
 
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