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Hsueh, Chun-Hway (2002) Modeling of thermal stresses in passivated interconnects. Journal of Applied Physics, 92 (1). 144-153 doi:10.1063/1.1483382

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Reference TypeJournal (article/letter/editorial)
TitleModeling of thermal stresses in passivated interconnects
JournalJournal of Applied Physics
AuthorsHsueh, Chun-HwayAuthor
Year2002 (July)Volume92
Issue1
PublisherAIP Publishing
DOIdoi:10.1063/1.1483382Search in ResearchGate
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Mindat Ref. ID5115095Long-form Identifiermindat:1:5:5115095:8
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Full ReferenceHsueh, Chun-Hway (2002) Modeling of thermal stresses in passivated interconnects. Journal of Applied Physics, 92 (1). 144-153 doi:10.1063/1.1483382
Plain TextHsueh, Chun-Hway (2002) Modeling of thermal stresses in passivated interconnects. Journal of Applied Physics, 92 (1). 144-153 doi:10.1063/1.1483382
In(2002, July) Journal of Applied Physics Vol. 92 (1) AIP Publishing

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Hsueh, Chun-Hway (2002) Modeling of elastic deformation of multilayers due to residual stresses and external bending. Journal of Applied Physics, 91 (12). 9652pp. doi:10.1063/1.1478137
Hsueh, Chun-Hway, Lee, Sanboh (2002) Effects of viscous flow on residual stresses in film/substrate systems. Journal of Applied Physics, 91 (5). 2760-2765 doi:10.1063/1.1445282
Hsueh, Chun-Hway (2000) Analyses of edge effects on residual stresses in film strip/substrate systems. Journal of Applied Physics, 88 (5). 3022-3028 doi:10.1063/1.1288161
Wikström, A., Gudmundson, P., Suresh, S. (1999) Analysis of average thermal stresses in passivated metal interconnects. Journal of Applied Physics, 86 (11). 6088-6095 doi:10.1063/1.371658
Sharma, P., Ardebili, H., Loman, J. (2001) Note on the thermal stresses in passivated metal interconnects. Applied Physics Letters, 79 (11). 1706-1708 doi:10.1063/1.1404124
Shen, Y.-L. (1997) Modeling of thermal stresses in metal interconnects: Effects of line aspect ratio. Journal of Applied Physics, 82 (4). 1578-1581 doi:10.1063/1.365944
Hsueh, Chun-Hway (1992) Interfacial debonding and fiber pull-out stresses of fiber-reinforced composites. Materials Science and Engineering: A, 159. 65-72 doi:10.1016/0921-5093(92)90399-l
Liu, Chun-Li (2002) Modeling and simulation design of advanced Cu alloy interconnects. Journal of Applied Physics, 91 (9). 6089-6094 doi:10.1063/1.1459756
Ko, Sun-Chien, Lee, Sanboh, Hsueh, Chun-Hway (2003) Viscoelastic stress relaxation in film/substrate systems—Kelvin model. Journal of Applied Physics, 93 (5). 2453-2457 doi:10.1063/1.1541108
Hsueh, Chun-Hway, Miranda, Pedro, Becher, Paul F. (2006) An improved correlation between impression and uniaxial creep. Journal of Applied Physics, 99 (11). 113513pp. doi:10.1063/1.2200727
HSUEH, CHUN-HWAY, BECHER, PAUL F., ANGELINI, PETER (1988) Effects of Interfacial Films on Thermal Stresses in Whisker-Reinforced Ceramics. Journal of the American Ceramic Society, 71 (11). 929-933 doi:10.1111/j.1151-2916.1988.tb07560.x
 
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