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Huang, Annie T., Tu, K. N., Lai, Yi-Shao (2006) Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints. Journal of Applied Physics, 100 (3). 33512pp. doi:10.1063/1.2227621

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Reference TypeJournal (article/letter/editorial)
TitleEffect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints
JournalJournal of Applied Physics
AuthorsHuang, Annie T.Author
Tu, K. N.Author
Lai, Yi-ShaoAuthor
Year2006 (August)Volume100
Issue3
PublisherAIP Publishing
DOIdoi:10.1063/1.2227621Search in ResearchGate
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Mindat Ref. ID5143132Long-form Identifiermindat:1:5:5143132:1
GUID0
Full ReferenceHuang, Annie T., Tu, K. N., Lai, Yi-Shao (2006) Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints. Journal of Applied Physics, 100 (3). 33512pp. doi:10.1063/1.2227621
Plain TextHuang, Annie T., Tu, K. N., Lai, Yi-Shao (2006) Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints. Journal of Applied Physics, 100 (3). 33512pp. doi:10.1063/1.2227621
In(2006, August) Journal of Applied Physics Vol. 100 (3) AIP Publishing

See Also

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Huang, Annie T., Gusak, A. M., Tu, K. N., Lai, Yi-Shao (2006) Thermomigration in SnPb composite flip chip solder joints. Applied Physics Letters, 88 (14). 141911pp. doi:10.1063/1.2192694
Ouyang, Fan-Yi, Tu, K. N., Lai, Yi-Shao, Gusak, Andriy M. (2006) Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration. Applied Physics Letters, 89 (22). 221906pp. doi:10.1063/1.2385205
Ouyang, Fan-Yi, Tu, K. N., Kao, Chin-Li, Lai, Yi-Shao (2007) Effect of electromigration in the anodic Al interconnect on melting of flip chip solder joints. Applied Physics Letters, 90 (21). 211914pp. doi:10.1063/1.2743395
Ouyang, Fan-Yi, Tu, K.N., Lai, Yi-Shao (2012) Effect of electromigration induced joule heating and strain on microstructural recrystallization in eutectic SnPb flip chip solder joints. Materials Chemistry and Physics, 136. 210-218 doi:10.1016/j.matchemphys.2012.06.054
Ouyang, Fan-Yi, Chen, Kai, Tu, K. N., Lai, Yi-Shao (2007) Effect of current crowding on whisker growth at the anode in flip chip solder joints. Applied Physics Letters, 91 (23). 231919pp. doi:10.1063/1.2822446
Liang, Y. C., Tsao, W. A., Chen, Chih, Yao, Da-Jeng, Huang, Annie T., Lai, Yi-Shao (2012) Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints. Journal of Applied Physics, 111 (4). 43705pp. doi:10.1063/1.3682484
Liang, S. W., Chang, Y. W., Shao, T. L., Chen, Chih, Tu, K. N. (2006) Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration. Applied Physics Letters, 89 (2). 22117pp. doi:10.1063/1.2220550
Liang, S. W., Chen, Chih, Han, J. K., Xu, Luhua, Tu, K. N., Lai, Yi-Shao (2010) Blocking hillock and whisker growth by intermetallic compound formation in Sn-0.7Cu flip chip solder joints under electromigration. Journal of Applied Physics, 107 (9). 93715pp. doi:10.1063/1.3410796
Xu, Luhua, Han, Jung-Kyu, Liang, Jarrett Jun, Tu, K. N., Lai, Yi-Shao (2008) Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column. Applied Physics Letters, 92 (26). 262104pp. doi:10.1063/1.2953692
Lee, T. Y., Tu, K. N., Frear, D. R. (2001) Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization. Journal of Applied Physics, 90 (9). 4502-4508 doi:10.1063/1.1400096
Nah, J. W., Suh, J. O., Tu, K. N. (2005) Effect of current crowding and Joule heating on electromigration-induced failure in flip chip composite solder joints tested at room temperature. Journal of Applied Physics, 98 (1). 13715pp. doi:10.1063/1.1949719
 
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