Reference Type | Journal (article/letter/editorial) |
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Title | Copper diffusion and mechanical toughness at Cu-silica interfaces glued with polyelectrolyte nanolayers |
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Journal | Journal of Applied Physics |
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Authors | Gandhi, D. D. | Author |
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Singh, A. P. | Author |
Lane, M. | Author |
Eizenberg, M. | Author |
Ramanath, G. | Author |
Year | 2007 (April 15) | Volume | 101 |
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Issue | 8 |
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Publisher | AIP Publishing |
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DOI | doi:10.1063/1.2717135Search in ResearchGate |
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| Generate Citation Formats |
Mindat Ref. ID | 5148172 | Long-form Identifier | mindat:1:5:5148172:4 |
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GUID | 0 |
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Full Reference | Gandhi, D. D., Singh, A. P., Lane, M., Eizenberg, M., Ramanath, G. (2007) Copper diffusion and mechanical toughness at Cu-silica interfaces glued with polyelectrolyte nanolayers. Journal of Applied Physics, 101 (8). 84505pp. doi:10.1063/1.2717135 |
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Plain Text | Gandhi, D. D., Singh, A. P., Lane, M., Eizenberg, M., Ramanath, G. (2007) Copper diffusion and mechanical toughness at Cu-silica interfaces glued with polyelectrolyte nanolayers. Journal of Applied Physics, 101 (8). 84505pp. doi:10.1063/1.2717135 |
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In | (2007, April) Journal of Applied Physics Vol. 101 (8) AIP Publishing |
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