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Liu, M., Qiu, L., Zheng, X. H., Zhu, J., Tang, D. W. (2014) Study on the thermal resistance in secondary particles chain of silica aerogel by molecular dynamics simulation. Journal of Applied Physics, 116 (9). 93503pp. doi:10.1063/1.4894511

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Reference TypeJournal (article/letter/editorial)
TitleStudy on the thermal resistance in secondary particles chain of silica aerogel by molecular dynamics simulation
JournalJournal of Applied Physics
AuthorsLiu, M.Author
Qiu, L.Author
Zheng, X. H.Author
Zhu, J.Author
Tang, D. W.Author
Year2014 (September 7)Volume116
Issue9
PublisherAIP Publishing
DOIdoi:10.1063/1.4894511Search in ResearchGate
Generate Citation Formats
Mindat Ref. ID5200426Long-form Identifiermindat:1:5:5200426:7
GUID0
Full ReferenceLiu, M., Qiu, L., Zheng, X. H., Zhu, J., Tang, D. W. (2014) Study on the thermal resistance in secondary particles chain of silica aerogel by molecular dynamics simulation. Journal of Applied Physics, 116 (9). 93503pp. doi:10.1063/1.4894511
Plain TextLiu, M., Qiu, L., Zheng, X. H., Zhu, J., Tang, D. W. (2014) Study on the thermal resistance in secondary particles chain of silica aerogel by molecular dynamics simulation. Journal of Applied Physics, 116 (9). 93503pp. doi:10.1063/1.4894511
In(2014, September) Journal of Applied Physics Vol. 116 (9) AIP Publishing

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