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Somaiah, Nalla, Kumar, Praveen (2018) Tuning electromigration-thermomigration coupling in Cu/W Blech structures. Journal of Applied Physics, 124 (18). 185102pp. doi:10.1063/1.5045086

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Reference TypeJournal (article/letter/editorial)
TitleTuning electromigration-thermomigration coupling in Cu/W Blech structures
JournalJournal of Applied Physics
AuthorsSomaiah, NallaAuthor
Kumar, PraveenAuthor
Year2018 (November 14)Volume124
Issue18
PublisherAIP Publishing
DOIdoi:10.1063/1.5045086Search in ResearchGate
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Mindat Ref. ID5210057Long-form Identifiermindat:1:5:5210057:0
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Full ReferenceSomaiah, Nalla, Kumar, Praveen (2018) Tuning electromigration-thermomigration coupling in Cu/W Blech structures. Journal of Applied Physics, 124 (18). 185102pp. doi:10.1063/1.5045086
Plain TextSomaiah, Nalla, Kumar, Praveen (2018) Tuning electromigration-thermomigration coupling in Cu/W Blech structures. Journal of Applied Physics, 124 (18). 185102pp. doi:10.1063/1.5045086
In(2018, November) Journal of Applied Physics Vol. 124 (18) AIP Publishing

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Somaiah, Nalla, Kumar, Praveen (2018) Inverse Blech Length Phenomenon in Thin-Film Stripes. Physical Review Applied, 10 (5). doi:10.1103/physrevapplied.10.054052
Talukder, Santanu, Somaiah, Nalla, Kumar, Praveen (2013) Effect of substrate surface roughness on electric current induced flow of liquid metals. Applied Physics Letters, 102 (5). 54101pp. doi:10.1063/1.4790182
Somaiah, Nalla, Sharma, Deepak, Kumar, Praveen (2016) Electric current induced forward and anomalous backward mass transport. Journal of Physics D: Applied Physics, 49. 20pp. doi:10.1088/0022-3727/49/20/20lt01
Blech, I. A. (1977) Copper electromigration in aluminum. Journal of Applied Physics, 48 (2). 473-477 doi:10.1063/1.323689
Blech, I. A., Meieran, E. S. (1972) Erratum: Electromigration in Thin Al Films. Journal of Applied Physics, 43 (2). 762 doi:10.1063/1.1661204
Blech, I. A., Meieran, E. S. (1969) Electromigration in Thin Al Films. Journal of Applied Physics, 40 (2). 485-491 doi:10.1063/1.1657425
Blech, I. A. (1977) Erratum: Electromigration in thin aluminum films on titanium nitride. Journal of Applied Physics, 48 (6). 2648 doi:10.1063/1.324308
Blech, I. A. (1976) Electromigration in thin aluminum films on titanium nitride. Journal of Applied Physics, 47 (4). 1203-1208 doi:10.1063/1.322842
Gu, Xin, Chan, Y. C. (2009) Thermomigration and electromigration in Sn58Bi solder joints. Journal of Applied Physics, 105 (9). 93537pp. doi:10.1063/1.3125458
Yao, Wei, Basaran, Cemal (2013) Computational damage mechanics of electromigration and thermomigration. Journal of Applied Physics, 114 (10). 103708pp. doi:10.1063/1.4821015
Blech, I. A., Rosenberg, R. (1975) On the direction of electromigration in gold thin films. Journal of Applied Physics, 46 (2). 579-583 doi:10.1063/1.321662
 
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