Lim, S.F., Nurulakmal, M.S. (2018) Wetting characterization of Flip chip’s Lead-Free Solder Interconnect Using Surface Evolver. Journal of Physics: Conference Series, 1082. 12055pp. doi:10.1088/1742-6596/1082/1/012055
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Wetting characterization of Flip chip’s Lead-Free Solder Interconnect Using Surface Evolver. | ||
Journal | Journal of Physics: Conference Series | ||
Authors | Lim, S.F. | Author | |
Nurulakmal, M.S. | Author | ||
Year | 2018 (August) | Volume | 1082 |
Publisher | IOP Publishing | ||
DOI | doi:10.1088/1742-6596/1082/1/012055Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 5288175 | Long-form Identifier | mindat:1:5:5288175:4 |
GUID | 0 | ||
Full Reference | Lim, S.F., Nurulakmal, M.S. (2018) Wetting characterization of Flip chip’s Lead-Free Solder Interconnect Using Surface Evolver. Journal of Physics: Conference Series, 1082. 12055pp. doi:10.1088/1742-6596/1082/1/012055 | ||
Plain Text | Lim, S.F., Nurulakmal, M.S. (2018) Wetting characterization of Flip chip’s Lead-Free Solder Interconnect Using Surface Evolver. Journal of Physics: Conference Series, 1082. 12055pp. doi:10.1088/1742-6596/1082/1/012055 | ||
In | (2018) Journal of Physics: Conference Series Vol. 1082. IOP Publishing |
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