Reference Type | Journal (article/letter/editorial) |
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Title | Laser printing of conformal and multi-level 3D interconnects |
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Journal | Applied Physics A |
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Authors | Kim, H. | Author |
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Duocastella, M. | Author |
Charipar, K. M. | Author |
Auyeung, R. C. Y. | Author |
Piqué, A. | Author |
Year | 2013 (October) | Volume | 113 |
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Publisher | Springer Science and Business Media LLC |
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DOI | doi:10.1007/s00339-013-7909-7Search in ResearchGate |
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| Generate Citation Formats |
Mindat Ref. ID | 6016543 | Long-form Identifier | mindat:1:5:6016543:9 |
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GUID | 0 |
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Full Reference | Kim, H., Duocastella, M., Charipar, K. M., Auyeung, R. C. Y., Piqué, A. (2013) Laser printing of conformal and multi-level 3D interconnects. Applied Physics A, 113. 5-8 doi:10.1007/s00339-013-7909-7 |
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Plain Text | Kim, H., Duocastella, M., Charipar, K. M., Auyeung, R. C. Y., Piqué, A. (2013) Laser printing of conformal and multi-level 3D interconnects. Applied Physics A, 113. 5-8 doi:10.1007/s00339-013-7909-7 |
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In | (2013) Applied Physics A Vol. 113. Springer Science and Business Media LLC |
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