Tang, Wen-ming, He, An-qiang, Liu, Qi, Ivey, Douglas-G. (2010) Solid state interfacial reactions in electrodeposited Ni/Sn couples. International Journal of Minerals, Metallurgy, and Materials, 17 (4). 459-463 doi:10.1007/s12613-010-0341-5
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Solid state interfacial reactions in electrodeposited Ni/Sn couples | ||
Journal | International Journal of Minerals, Metallurgy, and Materials | ||
Authors | Tang, Wen-ming | Author | |
He, An-qiang | Author | ||
Liu, Qi | Author | ||
Ivey, Douglas-G. | Author | ||
Year | 2010 (August) | Volume | 17 |
Issue | 4 | ||
Publisher | Springer Science and Business Media LLC | ||
DOI | doi:10.1007/s12613-010-0341-5Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 7736660 | Long-form Identifier | mindat:1:5:7736660:1 |
GUID | 0 | ||
Full Reference | Tang, Wen-ming, He, An-qiang, Liu, Qi, Ivey, Douglas-G. (2010) Solid state interfacial reactions in electrodeposited Ni/Sn couples. International Journal of Minerals, Metallurgy, and Materials, 17 (4). 459-463 doi:10.1007/s12613-010-0341-5 | ||
Plain Text | Tang, Wen-ming, He, An-qiang, Liu, Qi, Ivey, Douglas-G. (2010) Solid state interfacial reactions in electrodeposited Ni/Sn couples. International Journal of Minerals, Metallurgy, and Materials, 17 (4). 459-463 doi:10.1007/s12613-010-0341-5 | ||
In | (2010, August) International Journal of Minerals, Metallurgy, and Materials Vol. 17 (4) Springer Science and Business Media LLC |
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