Komiyama, Takao, Chonan, Yasunori, Onuki, Jin, Ohta, Toshihiko (2002) The Influence of Phosphorus Concentration of Electroless Plated Ni-P Film on Interfacial Structures in the Joints between Sn-Ag Solder and Ni-P Alloy Film. MATERIALS TRANSACTIONS, 43 (2). 227-231 doi:10.2320/matertrans.43.227
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | The Influence of Phosphorus Concentration of Electroless Plated Ni-P Film on Interfacial Structures in the Joints between Sn-Ag Solder and Ni-P Alloy Film | ||
Journal | MATERIALS TRANSACTIONS | ||
Authors | Komiyama, Takao | Author | |
Chonan, Yasunori | Author | ||
Onuki, Jin | Author | ||
Ohta, Toshihiko | Author | ||
Year | 2002 | Volume | 43 |
Issue | 2 | ||
Publisher | Japan Institute of Metals | ||
DOI | doi:10.2320/matertrans.43.227Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 7776320 | Long-form Identifier | mindat:1:5:7776320:2 |
GUID | 0 | ||
Full Reference | Komiyama, Takao, Chonan, Yasunori, Onuki, Jin, Ohta, Toshihiko (2002) The Influence of Phosphorus Concentration of Electroless Plated Ni-P Film on Interfacial Structures in the Joints between Sn-Ag Solder and Ni-P Alloy Film. MATERIALS TRANSACTIONS, 43 (2). 227-231 doi:10.2320/matertrans.43.227 | ||
Plain Text | Komiyama, Takao, Chonan, Yasunori, Onuki, Jin, Ohta, Toshihiko (2002) The Influence of Phosphorus Concentration of Electroless Plated Ni-P Film on Interfacial Structures in the Joints between Sn-Ag Solder and Ni-P Alloy Film. MATERIALS TRANSACTIONS, 43 (2). 227-231 doi:10.2320/matertrans.43.227 | ||
In | (2002) MATERIALS TRANSACTIONS Vol. 43 (2) Japan Institute of Metals |
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