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Sugizaki, Takashi, Nakao, Hidehiro, Kimura, Takashi, Watanabe, Tohru (2003) BGA Jointing Property of Sn-8.8 mass%Zn and Sn-8.0 mass%Zn-3.0 mass%Bi Solder on Electroless Nickel-Phosphorus/Immersion Gold Plated Substrates. MATERIALS TRANSACTIONS, 44 (9). 1790-1796 doi:10.2320/matertrans.44.1790

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Reference TypeJournal (article/letter/editorial)
TitleBGA Jointing Property of Sn-8.8 mass%Zn and Sn-8.0 mass%Zn-3.0 mass%Bi Solder on Electroless Nickel-Phosphorus/Immersion Gold Plated Substrates
JournalMATERIALS TRANSACTIONS
AuthorsSugizaki, TakashiAuthor
Nakao, HidehiroAuthor
Kimura, TakashiAuthor
Watanabe, TohruAuthor
Year2003Volume44
Issue9
PublisherJapan Institute of Metals
DOIdoi:10.2320/matertrans.44.1790Search in ResearchGate
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Mindat Ref. ID7777157Long-form Identifiermindat:1:5:7777157:5
GUID0
Full ReferenceSugizaki, Takashi, Nakao, Hidehiro, Kimura, Takashi, Watanabe, Tohru (2003) BGA Jointing Property of Sn-8.8 mass%Zn and Sn-8.0 mass%Zn-3.0 mass%Bi Solder on Electroless Nickel-Phosphorus/Immersion Gold Plated Substrates. MATERIALS TRANSACTIONS, 44 (9). 1790-1796 doi:10.2320/matertrans.44.1790
Plain TextSugizaki, Takashi, Nakao, Hidehiro, Kimura, Takashi, Watanabe, Tohru (2003) BGA Jointing Property of Sn-8.8 mass%Zn and Sn-8.0 mass%Zn-3.0 mass%Bi Solder on Electroless Nickel-Phosphorus/Immersion Gold Plated Substrates. MATERIALS TRANSACTIONS, 44 (9). 1790-1796 doi:10.2320/matertrans.44.1790
In(2003) MATERIALS TRANSACTIONS Vol. 44 (9) Japan Institute of Metals

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Sugizaki, Takashi, Nakao, Hidehiro, Kimura, Takashi, Watanabe, Tohru (2003) BGA Jointing Property of Sn-8.8 mass%Zn and Sn-8.0 mass%Zn-3.0 mass%Bi Solder on Electroless Nickel-Phosphorus/Immersion Gold Plated Substrates. Journal of the Japan Institute of Metals, 67 (5). 232-238 doi:10.2320/jinstmet1952.67.5_232
Sugizaki, Takashi, Nakao, Hidehiro, Watanabe, Tohru (2003) Jointing Structures of Some Kinds of Lead-Free Solder on EN/IG Finished Boards. Materials Science Forum, 426. 4117-4122 doi:10.4028/www.scientific.net/msf.426-432.4117
Chonan, Yasunori, Komiyama, Takao, Onuki, Jin, Urao, Ryoichi, Kimura, Takashi, Nagano, Takahiro (2002) Influence of P Content in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Zn Solder and Plated Au/Ni-P Alloy Film. MATERIALS TRANSACTIONS, 43 (8). 1887-1890 doi:10.2320/matertrans.43.1887
Chonan, Yasunori, Komiyama, Takao, Onuki, Jin, Urao, Ryoichi, Kimura, Takashi, Nagano, Takahiro (2002) Influence of Phosphorus Concentration in Electroless Plated Ni-P Alloy Film on Interfacial Structures and Strength between Sn-Ag-(-Cu) Solder and Plated Ni-P Alloy Film. MATERIALS TRANSACTIONS, 43 (8). 1840-1846 doi:10.2320/matertrans.43.1840
Cho, Sun-Yun, Lee, Young-Woo, Kim, Kyoo-Seok, Moon, Young-Jun, Lee, Ji-Won., Han, Hyun-Joo, Kim, Mi-Jin, Jung, Jae-Pil (2005) Reliability of Sn–8 mass%Zn–3 mass%Bi Lead-Free Solder and Zn Behavior. MATERIALS TRANSACTIONS, 46 (11). 2322-2328 doi:10.2320/matertrans.46.2322
Lee, Jaesik, Bang, Woongho, Jung, Jaepil, Oh, Kyuhwan (2004) Microstructure and Strength of Sn-Bi Coated Sn-3.5 mass%Ag Solder Alloy. MATERIALS TRANSACTIONS, 45 (3). 783-789 doi:10.2320/matertrans.45.783
Yoon, Jeong-Won, Lee, Chang-Bae, Jung, Seung-Boo (2002) Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate. MATERIALS TRANSACTIONS, 43 (8). 1821-1826 doi:10.2320/matertrans.43.1821
Snugovsky, L., Snugovsky, P., Perovic, D. D., Rutter, J. W. (2007) Formation of intermetallic compounds with Sn–Zn–Al solder on copper and electroless nickel–immersion gold substrates. Materials Science and Technology, 23. 1161-1166 doi:10.1179/174328407x213314
Yu, Qiang, Jin, Jae-Chul, Kim, Do-Seop, Shiratori, Masaki (2005) Fatigue Reliability Evaluation for Sn–Zn–Bi and Sn–Zn Lead-Free Solder Joints. MATERIALS TRANSACTIONS, 46 (11). 2316-2321 doi:10.2320/matertrans.46.2316
Miyazawa, Yasuyuki, Ariga, Tadashi (2001) Influences of Aging Treatment on Microstructure and Hardness of Sn-(Ag, Bi, Zn) Eutectic Solder Alloys. MATERIALS TRANSACTIONS, 42 (5). 776-782 doi:10.2320/matertrans.42.776
Ogawa, Naotaka, Miki, Takahiro, Nagasaka, Tetsuya, Hino, Mitsutaka (2002) Activity Measurement of the Constituents in Molten Sn-Mg-Zn Ternary Lead Free Solder Alloys by Mass Spectrometry. MATERIALS TRANSACTIONS, 43 (12). 3227-3233 doi:10.2320/matertrans.43.3227
 
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