Miura, Ken’ichi, Ishigami, Itsuo, Usui, Tateo (2004) Effects of Compressive Stress on Corrosion-Protective Quality and Its Maintenance under a Corrosive Environment for TiN Films Deposited by Reactive HCD Ion Plating. MATERIALS TRANSACTIONS, 45 (1). 102-111 doi:10.2320/matertrans.45.102
Reference Type | Journal (article/letter/editorial) | ||
---|---|---|---|
Title | Effects of Compressive Stress on Corrosion-Protective Quality and Its Maintenance under a Corrosive Environment for TiN Films Deposited by Reactive HCD Ion Plating | ||
Journal | MATERIALS TRANSACTIONS | ||
Authors | Miura, Ken’ichi | Author | |
Ishigami, Itsuo | Author | ||
Usui, Tateo | Author | ||
Year | 2004 | Volume | 45 |
Issue | 1 | ||
Publisher | Japan Institute of Metals | ||
DOI | doi:10.2320/matertrans.45.102Search in ResearchGate | ||
Generate Citation Formats | |||
Mindat Ref. ID | 7777175 | Long-form Identifier | mindat:1:5:7777175:1 |
GUID | 0 | ||
Full Reference | Miura, Ken’ichi, Ishigami, Itsuo, Usui, Tateo (2004) Effects of Compressive Stress on Corrosion-Protective Quality and Its Maintenance under a Corrosive Environment for TiN Films Deposited by Reactive HCD Ion Plating. MATERIALS TRANSACTIONS, 45 (1). 102-111 doi:10.2320/matertrans.45.102 | ||
Plain Text | Miura, Ken’ichi, Ishigami, Itsuo, Usui, Tateo (2004) Effects of Compressive Stress on Corrosion-Protective Quality and Its Maintenance under a Corrosive Environment for TiN Films Deposited by Reactive HCD Ion Plating. MATERIALS TRANSACTIONS, 45 (1). 102-111 doi:10.2320/matertrans.45.102 | ||
In | (2004) MATERIALS TRANSACTIONS Vol. 45 (1) Japan Institute of Metals |
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